Method, apparatus, system for centering in a high performance interconnect

ABSTRACT

In an example, a system and method for centering in a high-performance interconnect (HPI) are disclosed. When an interconnect is powered up from a dormant state, it may be necessary to “center” the clock signal to ensure that data are read at the correct time. A multi-phase method may be used, in which a first phase comprises a reference voltage sweep to identify an optimal reference voltage. A second phase comprises a phase sweep to identify an optimal phase. A third sweep comprises a two-dimensional “eye” phase, in which a plurality of values within a two-dimensional eye derived from the first two sweeps are tested. In each case, the optimal value is the value that results in the fewest bit error across multiple lanes. In one example, the second and third phases are performed in software, and may include testing a “victim” lane, with adjacent “aggressor” lanes having a complementary bit pattern.

RELATED CASES

This application is a continuation (and claims the benefit of priorityunder 35 U.S.C. §120 of U.S. application Ser. No. 14/583,139, filed Dec.25, 2014, entitled “METHOD, APPARATUS, SYSTEM FOR CENTERING IN AHIGH-PERFORMANCE INTERCONNECT.” The disclosure of the prior applicationis considered part of (and is incorporated by reference in) thedisclosure of this application.

FIELD

This disclosure pertains to computing system, and in particular (but notexclusively) to high-performance interconnects.

BACKGROUND

A high-performance interconnect (HPI) is a next-generation interconnectthat couples agents, such as processing cores, to one another, or tomemory. Thus HPI is an extremely fast protocol, operating on the orderof 8 Gbps at full speed. However, this extremely fast data rate makesHPI less fault tolerant than slower protocols. Thus, over time, withvoltage and temperature variations, clock signals may “drift” fromcenter, resulting in bit errors.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an embodiment of a block diagram for a computingsystem including a multicore processor.

FIG. 2 illustrates an embodiment of a layered stack for a highperformance interconnect architecture.

FIG. 3 illustrates embodiments of multi-processor configurationsutilizing a high performance interconnect architecture.

FIG. 4 illustrates a state machine of a high-performance interconnect.

FIGS. 5 and 5A illustrate test patterns for centering.

FIG. 6 is a flow chart of a method for centering.

FIG. 7 illustrates an embodiment of a block diagram of a multicoreprocessor.

FIG. 8 illustrates an embodiment of a block diagram for a processor.

FIG. 9 illustrates another embodiment of a block diagram for a computingsystem including a processor.

FIG. 10 illustrates an embodiment of a block for a computing systemincluding multiple processor sockets.

FIG. 11 illustrates another embodiment of a block diagram for acomputing system.

FIG. 12 illustrates another embodiment of a block diagram for acomputing system.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth,such as examples of specific types of processors and systemconfigurations, specific hardware structures, specific architectural andmicro architectural details, specific register configurations, specificinstruction types, specific system components, specificmeasurements/heights, specific processor pipeline stages and operationetc. in order to provide a thorough understanding of the presentinvention. It will be apparent, however, to one skilled in the art thatthese specific details need not be employed to practice the presentinvention. In other instances, well known components or methods, such asspecific and alternative processor architectures, specific logiccircuits/code for described algorithms, specific firmware code, specificinterconnect operation, specific logic configurations, specificmanufacturing techniques and materials, specific compilerimplementations, specific expression of algorithms in code, specificpower down and gating techniques/logic and other specific operationaldetails of computer system haven't been described in detail in order toavoid unnecessarily obscuring the present invention.

Although the following embodiments may be described with reference toenergy conservation and energy efficiency in specific integratedcircuits, such as in computing platforms or microprocessors, otherembodiments are applicable to other types of integrated circuits andlogic devices. Similar techniques and teachings of embodiments describedherein may be applied to other types of circuits or semiconductordevices that may also benefit from better energy efficiency and energyconservation. For example, the disclosed embodiments are not limited todesktop computer systems or Ultrabooks™. And may be also used in otherdevices, such as handheld devices, tablets, other thin notebooks,systems on a chip (SOC) devices, and embedded applications. Someexamples of handheld devices include cellular phones, Internet protocoldevices, digital cameras, personal digital assistants (PDAs), andhandheld PCs. Embedded applications typically include a microcontroller,a digital signal processor (DSP), a system on a chip, network computers(NetPC), set-top boxes, network hubs, wide area network (WAN) switches,or any other system that can perform the functions and operations taughtbelow. Moreover, the apparatus′, methods, and systems described hereinare not limited to physical computing devices, but may also relate tosoftware optimizations for energy conservation and efficiency. As willbecome readily apparent in the description below, the embodiments ofmethods, apparatus′, and systems described herein (whether in referenceto hardware, firmware, software, or a combination thereof) are vital toa ‘green technology’ future balanced with performance considerations.

As computing systems are advancing, the components therein are becomingmore complex. As a result, the interconnect architecture to couple andcommunicate between the components is also increasing in complexity toensure bandwidth requirements are met for optimal component operation.Furthermore, different market segments demand different aspects ofinterconnect architectures to suit the market's needs. For example,servers require higher performance, while the mobile ecosystem issometimes able to sacrifice overall performance for power savings. Yet,it's a singular purpose of most fabrics to provide highest possibleperformance with maximum power saving. Below, a number of interconnectsare discussed, which would potentially benefit from aspects of theinvention described herein.

FIG. 1

Referring to FIG. 1, an embodiment of a block diagram for a computingsystem including a multicore processor is depicted. Processor 100includes any processor or processing device, such as a microprocessor,an embedded processor, a digital signal processor (DSP), a networkprocessor, a handheld processor, an application processor, aco-processor, a system on a chip (SOC), or other device to execute code.Processor 100, in one embodiment, includes at least two cores—core 101and 102, which may include asymmetric cores or symmetric cores (theillustrated embodiment). However, processor 100 may include any numberof processing elements that may be symmetric or asymmetric.

In one embodiment, a processing element refers to hardware or logic tosupport a software thread. Examples of hardware processing elementsinclude: a thread unit, a thread slot, a thread, a process unit, acontext, a context unit, a logical processor, a hardware thread, a core,and/or any other element, which is capable of holding a state for aprocessor, such as an execution state or architectural state. In otherwords, a processing element, in one embodiment, refers to any hardwarecapable of being independently associated with code, such as a softwarethread, operating system, application, or other code. A physicalprocessor (or processor socket) typically refers to an integratedcircuit, which potentially includes any number of other processingelements, such as cores or hardware threads.

A core often refers to logic located on an integrated circuit capable ofmaintaining an independent architectural state, wherein eachindependently maintained architectural state is associated with at leastsome dedicated execution resources. In contrast to cores, a hardwarethread typically refers to any logic located on an integrated circuitcapable of maintaining an independent architectural state, wherein theindependently maintained architectural states share access to executionresources. As can be seen, when certain resources are shared and othersare dedicated to an architectural state, the line between thenomenclature of a hardware thread and core overlaps. Yet often, a coreand a hardware thread are viewed by an operating system as individuallogical processors, where the operating system is able to individuallyschedule operations on each logical processor.

Physical processor 100, as illustrated in FIG. 1, includes twocores—core 101 and 102. Here, core 101 and 102 are considered symmetriccores, i.e. cores with the same configurations, functional units, and/orlogic. In another embodiment, core 101 includes an out-of-orderprocessor core, while core 102 includes an in-order processor core.However, cores 101 and 102 may be individually selected from any type ofcore, such as a native core, a software managed core, a core adapted toexecute a native Instruction Set Architecture (ISA), a core adapted toexecute a translated Instruction Set Architecture (ISA), a co-designedcore, or other known core. In a heterogeneous core environment (i.e.asymmetric cores), some form of translation, such a binary translation,may be utilized to schedule or execute code on one or both cores. Yet tofurther the discussion, the functional units illustrated in core 101 aredescribed in further detail below, as the units in core 102 operate in asimilar manner in the depicted embodiment.

As depicted, core 101 includes two hardware threads 101 a and 101 b,which may also be referred to as hardware thread slots 101 a and 101 b.Therefore, software entities, such as an operating system, in oneembodiment potentially view processor 100 as four separate processors,i.e., four logical processors or processing elements capable ofexecuting four software threads concurrently. As alluded to above, afirst thread is associated with architecture state registers 101 a, asecond thread is associated with architecture state registers 101 b, athird thread may be associated with architecture state registers 102 a,and a fourth thread may be associated with architecture state registers102 b. Here, each of the architecture state registers (101 a, 101 b, 102a, and 102 b) may be referred to as processing elements, thread slots,or thread units, as described above. As illustrated, architecture stateregisters 101 a are replicated in architecture state registers 101 b, soindividual architecture states/contexts are capable of being stored forlogical processor 101 a and logical processor 101 b. In core 101, othersmaller resources, such as instruction pointers and renaming logic inallocator and renamer block 130 may also be replicated for threads 101 aand 101 b. Some resources, such as re-order buffers inreorder/retirement unit 135, ILTB 120, load/store buffers, and queuesmay be shared through partitioning. Other resources, such as generalpurpose internal registers, page-table base register(s), low-leveldata-cache and data-TLB 115, execution unit(s) 140, and portions ofout-of-order unit 135 are potentially fully shared.

Processor 100 often includes other resources, which may be fully shared,shared through partitioning, or dedicated by/to processing elements. InFIG. 1, an embodiment of a purely exemplary processor with illustrativelogical units/resources of a processor is illustrated. Note that aprocessor may include, or omit, any of these functional units, as wellas include any other known functional units, logic, or firmware notdepicted. As illustrated, core 101 includes a simplified, representativeout-of-order (OOO) processor core. But an in-order processor may beutilized in different embodiments. The OOO core includes a branch targetbuffer 120 to predict branches to be executed/taken and aninstruction-translation buffer (I-TLB) 120 to store address translationentries for instructions.

Core 101 further includes decode module 125 coupled to fetch unit 120 todecode fetched elements. Fetch logic, in one embodiment, includesindividual sequencers associated with thread slots 101 a, 101 b,respectively. Usually core 101 is associated with a first ISA, whichdefines/specifies instructions executable on processor 100. Oftenmachine code instructions that are part of the first ISA include aportion of the instruction (referred to as an opcode), whichreferences/specifies an instruction or operation to be performed. Decodelogic 125 includes circuitry that recognizes these instructions fromtheir opcodes and passes the decoded instructions on in the pipeline forprocessing as defined by the first ISA. For example, as discussed inmore detail below decoders 125, in one embodiment, include logicdesigned or adapted to recognize specific instructions, such astransactional instruction. As a result of the recognition by decoders125, the architecture or core 101 takes specific, predefined actions toperform tasks associated with the appropriate instruction. It isimportant to note that any of the tasks, blocks, operations, and methodsdescribed herein may be performed in response to a single or multipleinstructions; some of which may be new or old instructions. Notedecoders 126, in one embodiment, recognize the same ISA (or a subsetthereof). Alternatively, in a heterogeneous core environment, decoders126 recognize a second ISA (either a subset of the first ISA or adistinct ISA).

In one example, allocator and renamer block 130 includes an allocator toreserve resources, such as register files to store instructionprocessing results. However, threads 101 a and 101 b are potentiallycapable of out-of-order execution, where allocator and renamer block 130also reserves other resources, such as reorder buffers to trackinstruction results. Unit 130 may also include a register renamer torename program/instruction reference registers to other registersinternal to processor 100. Reorder/retirement unit 135 includescomponents, such as the reorder buffers mentioned above, load buffers,and store buffers, to support out-of-order execution and later in-orderretirement of instructions executed out-of-order.

Scheduler and execution unit(s) block 140, in one embodiment, includes ascheduler unit to schedule instructions/operation on execution units.For example, a floating point instruction is scheduled on a port of anexecution unit that has an available floating point execution unit.Register files associated with the execution units are also included tostore information instruction processing results. Exemplary executionunits include a floating point execution unit, an integer executionunit, a jump execution unit, a load execution unit, a store executionunit, and other known execution units.

Lower level data cache and data translation buffer (D-TLB) 150 arecoupled to execution unit(s) 140. The data cache is to store recentlyused/operated on elements, such as data operands, which are potentiallyheld in memory coherency states. The D-TLB is to store recentvirtual/linear to physical address translations. As a specific example,a processor may include a page table structure to break physical memoryinto a plurality of virtual pages.

Here, cores 101 and 102 share access to higher-level or further-outcache, such as a second level cache associated with on-chip interface110. Note that higher-level or further-out refers to cache levelsincreasing or getting further way from the execution unit(s). In oneembodiment, higher-level cache is a last-level data cache—last cache inthe memory hierarchy on processor 100—such as a second or third leveldata cache. However, higher level cache is not so limited, as it may beassociated with or include an instruction cache. A trace cache—a type ofinstruction cache—instead may be coupled after decoder 125 to storerecently decoded traces. Here, an instruction potentially refers to amacro-instruction (i.e. a general instruction recognized by thedecoders), which may decode into a number of micro-instructions(micro-operations).

In the depicted configuration, processor 100 also includes on-chipinterface module 110. Historically, a memory controller, which isdescribed in more detail below, has been included in a computing systemexternal to processor 100. In this scenario, on-chip interface 11 is tocommunicate with devices external to processor 100, such as systemmemory 175, a chipset (often including a memory controller hub toconnect to memory 175 and an I/O controller hub to connect peripheraldevices), a memory controller hub, a northbridge, or other integratedcircuit. And in this scenario, bus 105 may include any knowninterconnect, such as multi-drop bus, a point-to-point interconnect, aserial interconnect, a parallel bus, a coherent (e.g. cache coherent)bus, a layered protocol architecture, a differential bus, and a GTL bus.

Memory 175 may be dedicated to processor 100 or shared with otherdevices in a system. Common examples of types of memory 175 includeDRAM, SRAM, non-volatile memory (NV memory), and other known storagedevices. Note that device 180 may include a graphic accelerator,processor or card coupled to a memory controller hub, data storagecoupled to an I/O controller hub, a wireless transceiver, a flashdevice, an audio controller, a network controller, or other knowndevice.

Recently however, as more logic and devices are being integrated on asingle die, such as SOC, each of these devices may be incorporated onprocessor 100. For example in one embodiment, a memory controller hub ison the same package and/or die with processor 100. Here, a portion ofthe core (an on-core portion) 110 includes one or more controller(s) forinterfacing with other devices such as memory 175 or a graphics device180. The configuration including an interconnect and controllers forinterfacing with such devices is often referred to as an on-core (orun-core configuration). As an example, on-chip interface 110 includes aring interconnect for on-chip communication and a high-speed serialpoint-to-point link 105 for off-chip communication. Yet, in the SOCenvironment, even more devices, such as the network interface,co-processors, memory 175, graphics processor 180, and any other knowncomputer devices/interface may be integrated on a single die orintegrated circuit to provide small form factor with high functionalityand low power consumption.

In one embodiment, processor 100 is capable of executing a compiler,optimization, and/or translator code 177 to compile, translate, and/oroptimize application code 176 to support the apparatus and methodsdescribed herein or to interface therewith. A compiler often includes aprogram or set of programs to translate source text/code into targettext/code. Usually, compilation of program/application code with acompiler is done in multiple phases and passes to transform hi-levelprogramming language code into low-level machine or assembly languagecode. Yet, single pass compilers may still be utilized for simplecompilation. A compiler may utilize any known compilation techniques andperform any known compiler operations, such as lexical analysis,preprocessing, parsing, semantic analysis, code generation, codetransformation, and code optimization.

Larger compilers often include multiple phases, but most often thesephases are included within two general phases: (1) a front-end, i.e.generally where syntactic processing, semantic processing, and sometransformation/optimization may take place, and (2) a back-end, i.e.generally where analysis, transformations, optimizations, and codegeneration takes place. Some compilers refer to a middle, whichillustrates the blurring of delineation between a front-end and back endof a compiler. As a result, reference to insertion, association,generation, or other operation of a compiler may take place in any ofthe aforementioned phases or passes, as well as any other known phasesor passes of a compiler. As an illustrative example, a compilerpotentially inserts operations, calls, functions, etc. in one or morephases of compilation, such as insertion of calls/operations in afront-end phase of compilation and then transformation of thecalls/operations into lower-level code during a transformation phase.Note that during dynamic compilation, compiler code or dynamicoptimization code may insert such operations/calls, as well as optimizethe code for execution during runtime. As a specific illustrativeexample, binary code (already compiled code) may be dynamicallyoptimized during runtime. Here, the program code may include the dynamicoptimization code, the binary code, or a combination thereof.

Similar to a compiler, a translator, such as a binary translator,translates code either statically or dynamically to optimize and/ortranslate code. Therefore, reference to execution of code, applicationcode, program code, or other software environment may refer to: (1)execution of a compiler program(s), optimization code optimizer, ortranslator either dynamically or statically, to compile program code, tomaintain software structures, to perform other operations, to optimizecode, or to translate code; (2) execution of main program code includingoperations/calls, such as application code that has beenoptimized/compiled; (3) execution of other program code, such aslibraries, associated with the main program code to maintain softwarestructures, to perform other software related operations, or to optimizecode; or (4) a combination thereof.

In one embodiment, a new High Performance Interconnect (HPI) isprovided. HPI is a next-generation cache-coherent, link-basedinterconnect. As one example, HPI may be utilized in high performancecomputing platforms, such as workstations or servers, where PCIe istypically used to connect accelerators or I/O devices. However, HPI isnot so limited. Instead, HPI may be utilized in any of the systems orplatforms described herein. Furthermore, the individual ideas developedmay be applied to other interconnects, such as PCIe. Moreover, HPI maybe extended to compete in the same market as other interconnect, such asPCIe. To support multiple devices, in one implementation, HPI includesan Instruction Set Architecture (ISA) agnostic (i.e. HPI is able to beimplemented in multiple different devices). In another scenario, HPI mayalso be utilized to connect high performance I/O devices, not justprocessors or accelerators. For example, a high performance PCIe devicemay be coupled to HPI through an appropriate translation bridge (i.e.HPI to PCIe). Moreover, the HPI links may be utilized many HPI baseddevices, such as processors, in various ways (e.g. stars, rings, meshes,etc.). FIG. 3 illustrates an embodiment of multiple potentialmulti-socket configurations. A two-socket configuration 305, asdepicted, includes two HPI links; however, in other implementations, oneHPI link may be utilized. For larger topologies, any configuration maybe utilized as long as an ID is assignable and there is some form ofvirtual path. As shown 4 socket configuration 310 has an HPI link fromeach processor to another. But in the 8 socket implementation shown inconfiguration 315, not every socket is directly connected to each otherthrough an HPI link. However, if a virtual path exists between theprocessors, the configuration is supported. A range of supportedprocessors includes 2-32 in a native domain. Higher number of processorsmay be reached through use of multiple domains or other interconnectsbetween node controllers.

The HPI architecture includes a definition of a layered protocolarchitecture, which is similar to PCIe in that it also includes alayered protocol architecture. In one embodiment, HPI defines protocollayers (coherent, non-coherent, and optionally other memory basedprotocols), a routing layer, a link layer, and a physical layer.Furthermore, as many other interconnect architecture's HPI includesenhancements related to power managers, design for test and debug (DFT),fault handling, registers, security, etc.

FIG. 2 illustrates an embodiment of potential layers in the HPI layeredprotocol stack; however, these layers are not required and may beoptional in some implementations. Each layer deals with its own level ofgranularity or quantum of information (the protocol layer 205 a,b withpackets 230, link layer 210 a,b with flits 235, and physical layer 205a,b with phits 240). Note that a packet, in some embodiments, mayinclude partial flits, a single flit, or multiple flits based on theimplementation.

As a first example, a width of a phit 240 includes a 1 to 1 mapping oflink width to bits (e.g. 20 bit link width includes a phit of 20 bits,etc.). Flits may have a greater size, such as 184, 192, or 200 bits.Note that if phit 240 is 20 bits wide and the size of flit 235 is 184bits then it takes a fractional number of phits 240 to transmit one flit235 (e.g. 9.2 phits at 20 bits to transmit an 184 bit flit 235 or 9.6 at20 bits to transmit a 192 bit flit). Note that widths of the fundamentallink at the physical layer may vary. For example, the number of lanesper direction may include 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24,etc. In one embodiment, link layer 210 a,b is capable of embeddingmultiple pieces of different transactions in a single flit, and withinthe flit multiple headers (e.g. 1, 2, 3, 4) may be embedded within theflit. Here, HPI splits the headers into corresponding slots to enablemultiple messages in the flit destined for different nodes.

Physical layer 205 a,b, in one embodiment, is responsible for the fasttransfer of information on the physical medium (electrical or opticaletc.). The physical link is point to point between two Link layerentities, such as layer 205 a and 205 b. The Link layer 210 a,babstracts the Physical layer 205 a,b from the upper layers and providesthe capability to reliably transfer data (as well as requests) andmanage flow control between two directly connected entities. It also isresponsible for virtualizing the physical channel into multiple virtualchannels and message classes. The Protocol layer 220 a,b relies on theLink layer 210 a,b to map protocol messages into the appropriate messageclasses and virtual channels before handing them to the Physical layer205 a,b for transfer across the physical links. Link layer 210 a,b maysupport multiple messages, such as a request, snoop, response,writeback, non-coherent data, etc.

In one embodiment, to provide reliable transmission cyclic redundancycheck (CRC) error checking and recovery procedures are provided by theLink layer 210 a,b in order to isolate the effects of routine bit errorsthat occur on the physical interconnect. The Link layer 210 a generatesthe CRC at the transmitter and checks at the receiver Link layer 210 b.

In some implementations, link layer 210 a,b utilized a credit scheme forflow control. During initialization, a sender is given a set number ofcredits to send packets or flits to a receiver. Whenever a packet orflit is sent to the receiver, the sender decrements its credit countersby one credit which represents either a packet or a flit, depending onthe type of virtual network being used. Whenever a buffer is freed atthe receiver, a credit is returned back to the sender for that buffertype. When the sender's credits for a given channel have been exhausted,in one embodiment, it stops sending any flits in that channel.Essentially, credits are returned after the receiver has consumed theinformation and freed the appropriate buffers.

In one embodiment, routing layer 215 a,b provides a flexible anddistributed way to route packets from a source to a destination. In someplatform types (for example, uniprocessor and dual processor systems),this layer may not be explicit but could be part of the Link layer 210a,b; in such a case, this layer is optional. It relies on the virtualnetwork and message class abstraction provided by the Link Layer 210 a,bas part of the function to determine how to route the packets. Therouting function, in one implementation, is defined throughimplementation specific routing tables. Such a definition allows avariety of usage models.

In one embodiment, protocol layer 220 a,b implement the communicationprotocols, ordering rule, and coherency maintenance, I/O, interrupts,and other higher-level communication. Note that protocol layer 220 a,b,in one implementation provides messages to negotiate power states forcomponents and the system. As a potential addition, physical layer 205a,b may also independently or in conjunction set power states of theindividual links.

Multiple agents may be connect to an HPI architecture, such as a homeagent (orders requests to memory), caching (issues requests to coherentmemory and responds to snoops), configuration (deals with configurationtransactions), interrupt (processes interrupts), legacy (deals withlegacy transactions), non-coherent (deals with non-coherenttransactions), and others. More specific discussion of the layers forHPI are discussed below.

An overview of a few potential features of HPI includes: not utilizingpreallocation at home nodes; no ordering requirements for a number ofmessage classes; packing multiple messages in a single flit (protocolheader) (i.e. a packed flit that can hold multiple messages in definedslots); a wide link that may scale from 4, 8, 16, 20, or more lanes; alarge error checking scheme that may utilize 8, 16, 32, or as much as 64bits for error protection; and utilizing an embedded clocking scheme.

HPI Physical Layer

The Physical layer 205 a,b (or PHY) of HPI rests above the electricallayer (i.e. electrical conductors connecting two components) and belowthe link layer 210 a,b, as illustrated in FIG. 2. The physical layerresides on each agent and connects the link layers on two agents (A andB) separated from each other. The local and remote electrical layers areconnected by physical media (e.g. wires, conductors, optical, etc.). Thephysical layer 205 a,b, in one embodiment, has two major phases,initialization and operation. During initialization, the connection isopaque to the link layer and signaling may involve a combination oftimed states and handshake events. During operation, the connection istransparent to the link layer and signaling is at a speed, with alllanes operating together as a single link. During the operation phase,the physical layer transports flits from agent A to agent B and fromagent B to agent A. The connection is also referred to as a link andabstracts some physical aspects including media, width and speed fromthe link layers while exchanging flits and control/status of currentconfiguration (e.g. width) with the link layer. The initialization phaseincludes minor phases e.g. Polling, Configuration. The operation phasealso includes minor phases (e.g. link power management states).

In one embodiment, physical layer 205 a,b is also: to meet areliability/error standard, tolerate a failure of a lane on a link andgo to a fraction of nominal width, tolerate single failures in oppositedirection of a link, support hot add/remove, enabling/disabling PHYports, timeout initialization attempts when the number of attempts hasexceeded a specified threshold etc.

In one embodiment, HPI utilizes a rotating bit pattern. For example whena flit size is not aligned with a multiple of the lanes in an HPI link,the flit may not be able to be sent in an integer multiple oftransmissions over the lanes (e.g. a 192-bit flit is not a cleanmultiple of an exemplary 20 lane link. So at ×20 flits may beinterleaved to avoid wasting bandwidth (i.e. sending a partial flit atsome point without utilizing the rest of the lanes). The interleaving,in one embodiment, is determined to optimize latency of key fields andmultiplexers in the transmitter (Tx) and receiver (Rx). The determinedpatterning also potentially provides for clean and quick transitioningto/from a smaller width (e.g ×8) and seamless operation at the newwidth.

In one embodiment, HPI utilizes an embedded clock, such as a 20 bitembedded clock or other number of bit embedded clock. Other highperformance interfaces may use a forwarded clock or other clock forinband reset. By embedding clock in HPI, it potentially reduces pinout.However, using an embedded clock, in some implementations, may result indifferent apparatus and methods to handle inband reset. As a first,example a blocking link state to hold off link flit transmission andallow PHY usage (described in more detail in the Appendix A) is utilizedafter initialization. As a second example, electrical ordered sets, suchas an electrically idle ordered set (EIOS) may be utilized duringinitialization.

In one embodiment, HPI is capable of utilizing a first bit widthdirection without a forwarded clock and a second, smaller bit width linkfor power management. As an example, HPI includes a partial link widthtransmitting state, where a partial width is utilized (e.g. a ×20 fullwidth and a ×8 partial width); however, the widths are purelyillustrative and may differ. Here, the PHY may handle partial widthpower management without link layer assist or intervention. In oneembodiment, a blocking link state (BLS) protocol is utilized to enterthe partial width transmitting state (PWTS). PWTS exit, in one or moreimplementations, may use the BLS protocol or squelch break detection.Due to absence of a forwarded clock, PWTLS exit may include a re-deskew,which maintains determinism of the link.

In one embodiment, HPI utilizes Tx adaptation. As an example, loopbackstate and hardware is used for Tx Adaptation. As on example, HPI iscapable of counting actual bit errors; this may be able to be performedby injecting specialized patterns. As a result, HPI should be able toget better electrical margins at lower power. When using the loopbackstate, one direction may be used as a hardware backchannel with metricssent as part of a training sequence (TS) payload.

In one embodiment, HPI is able to provide latency fixing withoutexchanging sync counter values in a TS. Other interconnect may performlatency fixing based on such exchanging of a sync counter value in eachTS. Here, HPI may utilize periodically recurring Electrically Idle ExitOrdered Sets (EIEOS) as a proxy for the sync counter value by aligningthe EIEOS to the sync counter. This potentially saves TS payload space,removes aliasing, and DC balance concerns, as well as simplify thecalculation of latency to be added.

In one embodiment, HPI provides for software and timer control of a linkstate machine transitions. Other interconnect may support a semaphore(hold bit) that is set by hardware on entering an initialization state.Exit from the state occurs when the hold bit is cleared by software.HPI, in one implementation, allows software to control this type ofmechanism for entering a transmitting link state or a loop back patternstate. In one embodiment, HPI allows for exit from handshake sates to bebased on a software programmable timeout after handshake, whichpotentially makes test software easier.

In one embodiment, HPI utilizes Pseudo Random Bit Sequence (PRBS)scrambling of TS. As an example a 23-bit PRBS is utilized (PRBS23). Inone embodiment, the PRBS is generated by a similar bit size, self-seededstorage element, such as a linear feedback shift register. As oneexample, a fixed UI pattern may be utilized to scramble with a bypass toan adaptation state. But by scrambling TS with PRBS23, Rx adaptation maybe performed without the bypass. In addition, offset and other errorsmay be reduced during clock recovery and sampling. The HPI approachrelies on using Fibonacci LFSRs which can be self seeded during specificportions of the TS.

In one embodiment, HPI supports an emulated slow mode without changingPLL clock frequency. Some designs may use separate PLLs for slow andfast speed. Yet, in on implementation, HPI use emulated slow mode (i.e.PLL clock runs at fast speed; TX repeats bits multiple times; RXoversamples to locate edges and identify the bit.). This means thatports sharing a PLL may coexist at slow and fast speeds. In one examplewhere the multiple is an integer ratio of fast speed to slow speed,different fast speeds may work with the same slow speed, which may beused during the discovery phase of hot attach.

In one embodiment, HPI supports a common slow mode frequency for hotattach. Emulated slow mode, as described above, allows HPI ports sharinga PLL to coexist at slow and fast speeds. When a designer sets theemulation multiple as an integer ratio of fast speed to slow speed, thendifferent fast speeds may work with the same slow speed. So, two agentswhich support at least one common frequency may be hot attachedirrespective of the speed at which the host port is running. Softwarediscovery may then use the slow mode link to identify and setup the mostoptimal link speeds.

In one embodiment, HPI supports re-initialization of link withouttermination changes. One could provide re-initialization on an inbandreset having clock lane terminations changed for the discovery processused in reliability, availability, and serviceability (RAS). In oneembodiment, re-initialization for HPI may be done without changing thetermination values when HPI includes a RX screening of incomingsignaling to identify good lanes.

In one embodiment, HPI supports robust low power link state (LPLS)entry. As an example, HPI may include a minimum stay in LPLS (i.e. aminimum amount of time, UI, counter value, etc that a link stays in LPLSbefore an exit). Alternatively, LPLS entry may be negotiated and thenuse an inband reset to enter LPLS. But this may mask an actual inbandreset originating from the second agent in some cases. HPI, in someimplementations, allows a first agent to enter LPLS and a second agentto enter Reset. The first agent is unresponsive for a time period (i.e.the minimum stay), which allows the second agent to complete reset andthen wake up the first agent, enabling a much more efficient, robustentry into LPLS.

In one embodiment, HPI supports features such as debouncing detect, wakeand continuous screening for lane failures. HPI may look for a specifiedsignaling pattern for an extended period of time to detect a valid wakefrom a LPLS thus reducing the chances of a spurious wake. The samehardware may also be used in the background for continuously screeningfor bad lanes during the initialization process making for a more robustRAS feature.

In one embodiment, HPI supports a deterministic exit for lock step andrestart-replay. In HPI, some TS boundaries may coincide with flitboundaries when operating at full width. So HPI may identify and specifythe exit boundaries such that lock-step behavior may be maintained withanother link. In addition, HPI may specify timers which may be used tomaintain lock step with a link pair. After initialization, HPI may alsosupport operation with inband resets disabled to support some flavors oflock-step operation.

In one embodiment, HPI supports use of TS header instead of payload forkey initialization parameters. Alternatively, TS payload may be used toexchange init parameters like ACKs and lane numbers. And DC levels forcommunicating lane polarity may also be used. Yet, HPI may use DCbalanced codes in the TS header for key parameters. This potentiallyreduces the number of bytes needed for a payload and potentially allowsfor an entire PRBS23 pattern to be used for scrambling TS, which reducesthe need for DC balancing the TS.

In one embodiment, HPI supports measures to increase noise immunity ofactive lanes during partial width transmitting link state (PWTLS)entry/exit of idle lanes. In one embodiment, null (or othernon-retryable flits) flits may be used around the width change point toincrease noise immunity of active lanes. Additionally, HPI may utilizenull flits around the start of PWTLS exit (i.e. the null flits may bebroken up with data flits). HPI may also use specialized signaling,whose format may be varied to reduce chances of false wake detects.

In one embodiment, HPI supports use of specialized patterns during PWTLSexit to allow non-blocking deskew. Alternatively, idle lanes may not bedeskewed on PWTLS exit since they may maintain skew with help of aforwarded clock. Yet, with use of an embedded clock, HPI may usespecialized signaling, whose format may be varied to reduce chances offalse wake detects and also allow for deskew without blocking flit flow.This also allows for more robust RAS by seamlessly powering down failinglanes, re-adapting them, and bringing them back online without blockingthe flow of flits.

In one embodiment, HPI supports low power link state (LPLS) entrywithout link layer support and more robust LPLS exit. Alternatively,link layer negotiation may be depended on between pre-designated masterand slave to enter LPLS from transmitting link state (TLS). In HPI, thePHY may handle negotiation using blocking link state (BLS) codes and maysupport both agents being masters or initiators, as well as entry intoLPLS directly from PWTLS. Exit from LPLS may be based on debouncing asquelch break using a specific pattern followed by handshake between thetwo sides and a timeout induced inband reset if any of this fails.

In one embodiment, HPI supports controlling unproductive looping duringinitialization. Alternatively, a failure to init (e.g. lack of goodlanes) may result in retrying the init too many times, which potentiallywastes power and is difficult to debug. In HPI, the link-pair may try toinit a set number of times before calling it quits and powering down ina reset state, where software may make adjustments before retrying theinit. This potentially improves the RAS of the system.

In one embodiment, HPI supports advanced IBIST (interconnect built inself test) options. In one embodiment, a pattern generator may beutilized, which allows for two non-correlated PRBS23 patterns of maximumlength for any pin. In one embodiment, HPI may be able to support foursuch patterns, as well as provide the ability to control the length ofthese patterns (i.e. dynamically vary test pattern, PRBS23 length).

In one embodiment, HPI provides advanced logic to deskew lanes. As anexample, the TS boundary after TS lock may be used to deskew the lanes.In addition, HPI may deskew by comparing lane PRBS patterns in the LFSRduring specific points in the payload. Such deskew might be useful intestchips, which may lack ability to detect TS or state machines tomanage the deskew.

In one embodiment, exit from init to link transmitting occurs on a TSboundary with planetary alignment. In addition, HPI may support anegotiated delay from that point. In addition, the order of exit betweenthe two directions may be controlled by using master-slave determinismallowing for one instead of two planetary alignment controls for thelink pair.

Some implementations use a fixed 128UI pattern to scramble TS. Othersuse a fixed 4 k PRBS23 to scramble TS. HPI, in one embodiment, allowsfor using any length PRBS including an entire (8M-1) PRBS23 sequence.

In some architectures adaptation is of fixed duration. In oneembodiment, the exit from Adapt is handshaked rather than timed. Thismeans that Adapt times may be asymmetric between the two directions andas long as needed by either side.

In one embodiment, a state machine may bypass states if those stateactions don't need to be redone. However, this may lead to more complexdesigns and validation escapes. HPI doesn't use bypasses—instead itdistributes actions such that short timers in each state may be used toperform the actions and bypasses avoided. This potentially makes formore uniform and synchronized state machine transitions.

In some architectures, forwarded clock is utilized for Inband reset andlink layer for staging partial width transmitting and for low power linkentry. HPI uses block linking state codes similar functions. These codespotentially could have bit errors leading to ‘mismatches’ at Rx. HPIincludes a protocol for dealing with mismatches as well as means tohandle asynchronous reset, low power link state and partial width linkstate requests.

In one embodiment, a 128 UI scrambler is utilized for loopback TS.However, this can lead to aliasing for TS lock when loopback begins; sosome architecture's changes the payload to all Os during this. Inanother embodiment, HPI utilizes a uniform payload and uses theperiodically occurring unscrambled EIEOS for TS lock.

Some architecture utilize scrambled TS during init. In one embodiment,HPI defines supersequences that are combinations of scrambled TS ofvarious lengths and unscrambled EIEOS. This allows more randomizedtransitions during init and also simplifies TS lock, latency fixing, andother actions.

HPI Link Layer

Returning to FIG. 2, an embodiment of a logical block for link layer 210a,b is illustrated. In one embodiment, Link Layer 210 a,b guaranteesreliable data transfer between two protocol or routing entities. Itabstracts Physical layer 205 a,b from the Protocol layer 220 a,b, isresponsible for the flow control between two protocol agents (A, B), andprovides virtual channel services to the Protocol layer (MessageClasses) and Routing layer (Virtual Networks). The interface between theProtocol layer 220 a,b and the Link Layer 210 a,b is typically at thepacket level. In one embodiment, the smallest transfer unit at the LinkLayer is referred to as a flit which a specified number of bits, such as192. The Link Layer 210 a,b relies on the Physical layer 205 a,b toframe the Physical layer 205 a,b's unit of transfer (phit) into the LinkLayer 210 a,b′ unit of transfer (flit). In addition, the Link Layer 210a,b may be logically broken into two parts, a sender and a receiver. Asender/receiver pair on one entity may be connected to a receiver/senderpair on another entity. Flow Control is often performed on both a flitand a packet basis. Error detection and correction is also potentiallyperformed on a flit level basis.

In one embodiment, flits are expanded 192 bits. However, any range ofbits, such as 81-256 (or more) may be utilized in different variations.Here, the CRC field is also increased (e.g. 16 bits) to handle a largerpayload.

In one embodiment, TIDs (Transaction IDs) are 11 bits in length. As aresult, pre-allocation and the enabling of distributed home agents maybe removed. Furthermore, use of 11 bits, in some implementations, allowsfor the TID to be used without having use for an extended TID mode.

In one embodiment, header flits are divided into 3 slots, 2 with equalsize (Slots 0 and 1) and another smaller slot (Slot 2). A floating fieldmay be available for one of Slot 0 or 1 to use. The messages that canuse slot 1 and 2 are optimized, reducing the number of bits needed toencode these slots' opcodes. When a header needing more bits that Slot 0provides enters the link layer, slotting algorithms are in place toallow it to take over Slot 1 payload bits for additional space. Specialcontrol (e.g. LLCTRL) flits may consume all 3 slots worth of bits fortheir needs. Slotting algorithms may also exist to allow individualslots to be utilized while other slots carry no information, for caseswhere the link is partially busy. Other interconnect may allow a singlemessage per flit, instead of multiple. The sizing of the slots withinthe flit, and the types of messages that can be placed in each slot,potentially provide the increased bandwidth of HPI even with a reducedflit rate. For a more detailed description of flits and the multi-slotheader, refer to the flit definition section of Appendix B.

In HPI, a large CRC baseline may improve error detection. For example, a16 bit CRC is utilized. As a result of the larger CRC, a larger payloadmay also be utilized. The 16 bits of CRC in combination with apolynomial used with those bits improves error detection. As an example,the are a minimum number of gates to provide 1) 1-4 bit errors detected2) errors of burst length 16 or less are detected.

In one embodiment, a rolling CRC based on two CRC-16 equations isutilized. Two 16 bit polynomials may be used, the polynomial from HPICRC-16 and a second polynomial. The second polynomial has the smallestnumber of gates to implement while retaining the properties of 1) all1-7 bit errors detected 2) per lane burst protection in ×8 link widths3) all errors of burst length 16 or less are detected.

In one embodiment, a reduced max flit rate (9.6 versus 4 UI) isutilized, but increased throughput of the link is obtained. As a resultof the increased flit size, introduction of multiple slots per flit,optimized utilization of payload bits (changed algorithms to remove orrelocate infrequently used fields), more interconnect efficiency isachieved.

In one embodiment, part of the support for 3 slots includes 192 bitflit. The floating field enables 11 extra bits of payload for eitherslot 0 or slot 1. Note if a larger flit is used more floating bits maybe used. And as a corollary, if a smaller flit is used, then lessfloating bits are provided. By allowing a field to float between the twoslots, we can provide the extra bits needed for certain messages, whilestill staying within 192 bits and maximizing the utilization of thebandwidth. Alternatively, providing an 11 bit HTID field to each slotmay use an extra 11 bits in the flit which would not be as efficientlyutilized.

Some interconnects may transmit Viral status in protocol level messagesand Poison status in data flits. In one embodiment, HPI protocol levelmessages and Poison status are moved to control flits. Since these bitsare infrequently used (only in the case of errors), removing them fromthe protocol level messages potentially increases flit utilization.Injecting them using control flits still allows containment of theerrors.

In one embodiment, CRD and ACK bits in a flit allow return of a numberof credits, such as eight, or the number of acks, such as 8. As part ofthe fully encoded credit fields, these bits are utilized as Credit[n]and Acknowledge[n] when Slot 2 is encoded as LLCRD. This potentiallyimproves efficiency by allowing any flit to return the number of VNACredits and the number of Acknowledges using a total of only 2 bits, butalso allowing their definitions to remain consistent when a fullyencoded LLCRD return is used.

In one embodiment, VNA vs. VN0/1 encoding (saves bits by aligning slotsto same encoding). The slots in a multi-slot header flit may be alignedto just VNA, just VN0, or just VN1. By enforcing this, per slot bitsindicating VN are removed. This increases the efficiency of flit bitutilization and potentially enables expanding from 10 bit TIDs to 11 bitTIDs.

Some fields only allow return in increments of 1 (for VN0/1), 2/8/16(for VNA), and 8 (for Acknowledge). This means that returning a largenumber of pending Credits or Acknowledges may use multiple returnmessages. It also means that odd numbered return values for VNA andAcknowledge may be left stranded pending accumulation of an evenlydivisible value. HPI may have fully encoded Credit and Ack returnfields, allowing an agent to return all accumulated Credits or Acks fora pool with a single message. This potentially improves link efficiencyand also potentially simplifies logic implementation (return logic canimplement a “clear” signal rather than a full decrementer)

Routing Layer

In one embodiment, Routing layer 215 a,b provides a flexible anddistributed method to route HPI transactions from a source to adestination. The scheme is flexible since routing algorithms formultiple topologies may be specified through programmable routing tablesat each router (the programming in one embodiment is performed byfirmware, software, or a combination thereof). The routing functionalitymay be distributed; the routing may be done through a series of routingsteps, with each routing step being defined through a lookup of a tableat either the source, intermediate, or destination routers. The lookupat a source may be used to inject a HPI packet into the HPI fabric. Thelookup at an intermediate router may be used to route an HPI packet froman input port to an output port. The lookup at a destination port may beused to target the destination HPI protocol agent. Note that the Routinglayer, on some implementations, is thin since the routing tables, and,hence the routing algorithms, are not specifically defined byspecification. This allows a variety of usage models, including flexibleplatform architectural topologies to be defined by the systemimplementation. The Routing layer 215 a,b relies on the Link layer 210a,b for providing the use of up to three (or more) virtual networks(VNs)—in one example, two deadlock-free VNs, VN0 and VN1 with severalmessage classes defined in each virtual network. A shared adaptivevirtual network (VNA) may be defined in the link layer, but thisadaptive network may not be exposed directly in Routing Concepts, sinceeach Message class and VN may have dedicated resources and guaranteedforward progress.

A non-exhaustive, exemplary list of routing rules includes: (1) (Messageclass invariance): An incoming packet belonging to a particular messageclass may berouted on an outgoing HPI port/virtual network in the samemessage class; (2) (Switching) HPI platforms may support the“store-and-forward” and “virtual cut through” types of switching. Inanother embodiment, HPI may not support “wormhole” or “circuit”switching. (3) (Interconnect deadlock freedom) HPI platforms may notrely on adaptive flows for deadlock-free routing. With platforms, whichuse both VN0 and VN1, the 2 VNs together may be used for deadlock-freerouting; and (4) (VN0 for “leaf” routers). In HPI platforms, which mayuse both VN0 and VN1, it is permissible to use VN0 for those components,whose routers are not used route-through; that is, incoming ports haveHPI destinations that terminate at this component. In such a case,packets from different VNs can be routed to VN0. Other rules (forexample, movement of packets between VN0 and VN1) may be governed by aplatform dependent routing algorithm.

Routing step: A routing step, in one embodiment, is referred to by arouting function (RF) and a selection function (SF). The routingfunction may take, as inputs, a HPI port at which a packet arrives and adestination NodeID; it then yields as output a 2-tuple—the HPI portnumber and the virtual network—which the packet should follow on itspath to the destination. It is permitted for the routing function to beadditionally dependent on the incoming virtual network. Further, it ispermitted with the routing step to yield multiple <port#, virtualnetwork> pairs. The resulting routing algorithms are called adaptive. Insuch a case, a selection function SF may choose a single 2-tuple basedon additional state information which the router has (for example, withadaptive routing algorithms, the choice of a particular port of virtualnetwork may depend on the local congestion conditions). A routing step,in one embodiment, consists of applying the routing function and thenthe selection function to yield the 2-tuple(s).

Router Table Simplifications: HPI platforms may implement legal subsetsof the virtual networks. Such subsets simplify the size of the routingtable (reduce the number of columns) associated virtual channelbuffering and arbitration at the router switch. These simplificationsmay come at the cost of platform flexibility and features. VN0 and VN1may be deadlock-free networks which provide deadlock freedom eithertogether or singly, depending on the usage model, usually with minimalvirtual channel resources assigned to them. Flat organization of therouting table may include a size corresponding to the maximum number ofNodeIDs. With such an organization, the routing table may be indexed bythe destination NodeID field and possibly by the virtual network idfield. The table organization can also be made hierarchical with thedestination NodeID field being sub-divided into multiple sub-fields,which is implementation dependent. For example, with a division into“local” and “non-local” parts, the “non-local” part of the routing iscompleted before the routing of the “local” part. The potentialadvantage of reducing the table size at every input port comes at thepotential cost of being forced to assign NodeIDs to HPI components in ahierarchical manner

Routing Algorithm: A routing algorithm, in one embodiment, defines theset of permissible paths from a source module to a destination module. Aparticular path from the source to the destination is a subset of thepermissible paths and is obtained as a series of routing steps definedabove starting with the router at the source, passing through zero ormore intermediate routers, and ending with the router at thedestination. Note that even though an HPI fabric may have multiplephysical paths from a source to a destination, the paths permitted arethose defined by the routing algorithm.

HPI Coherence Protocol

In one embodiment, the HPI Coherence Protocol is included in layer 220a,b is to support agents caching lines of data from memory. An agentwishing to cache memory data may use the coherence protocol to read theline of data to load into its cache. An agent wishing to modify a lineof data in its cache may use the coherence protocol to acquire ownershipof the line before modifying the data. After modifying a line, an agentmay follow protocol requirements of keeping it in its cache until iteither writes the line back to memory or includes the line in a responseto an external request. Lastly, an agent may fulfill external requeststo invalidate a line in its cache. The protocol ensures coherency of thedata by dictating the rules all caching agents may follow. It alsoprovides the means for agents without caches to coherently read andwrite memory data.

Two conditions may be enforced to support transactions utilizing the HPICoherence Protocol. First, the protocol maintains data consistency, asan example on a per-address basis, among data in agents' caches andbetween those data and the data in memory. Informally, data consistencymay refer to each valid line of data in an agent's cache representing amost up-to-date value of the data and data transmitted in a coherenceprotocol packet represents the most up-to-date value of the data at thetime it was sent. When no valid copy of the data exists in caches or intransmission, the protocol may ensure the most up-to-date value of thedata resides in memory. Second, the protocol provides well-definedcommitment points for requests. Commitment points for reads may indicatewhen the data is usable; and for writes they may indicate when thewritten data is globally observable and will be loaded by subsequentreads. The protocol may support these commitment points for bothcacheable and uncacheable (UC) requests in the coherent memory space.

The HPI Coherence Protocol also may ensure the forward progress ofcoherence requests made by an agent to an address in the coherent memoryspace. Certainly, transactions may eventually be satisfied and retiredfor proper system operation. The HPI Coherence Protocol, in someembodiments, may have no notion of retry for resolving resourceallocation conflicts. Thus, the protocol itself may be defined tocontain no circular resource dependencies, and implementations may takecare in their designs not to introduce dependencies that can result indeadlocks. Additionally, the protocol may indicate where designs areable to provide fair access to protocol resources.

Logically, the HPI Coherence Protocol, in one embodiment, consists ofthree items: coherence (or caching) agents, home agents, and the HPIinterconnect fabric connecting the agents. Coherence agents and homeagents work together to achieve data consistency by exchanging messagesover the interconnect. The link layer 210 a,b and its relateddescription provides the details of the interconnect fabric includinghow it adheres to the coherence protocol's requirements, discussedherein. (It may be noted that the division into coherence agents andhome agents is for clarity. A design may contain multiple agents of bothtypes within a socket or even combine agents behaviors into a singledesign unit.).

In one embodiment, HPI does not pre-allocate resources of a Home Agent.Here, a Receiving Agent receiving a request allocates resource toprocess it. An Agent sending a request allocates resources forresponses. In this scenario, HPI may follow two general rules regardingresource allocation. First, an agent receiving a request may beresponsible for allocating the resource to process it. Second, an agentgenerating a request may be responsible for allocating resources toprocess responses to the request.

For allocation of resources may also extend to HTID (along withRNID/RTID) in snoop requests The potential reduction of using a homeagent and forward responses to support responses to Home Agent (and dataforwarding to requesting agent).

In one embodiment, home agent resources are also not pre-allocated insnoop requests and forward responses to support responses to the homeagent (and data forwarding to the requesting agent.

In one embodiment, there is no pre-allocation of Home resources Abilityto send CmpO “early”, before Home Agent is finished processing request,when it is safe for requesting agent to reuse its RTID resource. Generalhandling of snoops with similar RNID/RTID in system also part ofprotocol.

In one embodiment, conflict resolution is performed using an orderedresponse channel. A Coherence Agent uses RspCnflt as request for a HomeAgent to send a FwdCnfltO, which will be ordered with the CmpO (if anyalready scheduled) for the Coherence Agent's conflicting request.

In one embodiment, HPI supports conflict resolution via an orderedresponse channel. A Coherence Agent using information from snoop to aidin processing FwdCnfltO, which has no “type” information and no RTID forforwarding data to requesting agent.

In one embodiment, a Coherence Agent blocks forwards for writebackrequests to maintain data consistency. But it also allows CoherenceAgent to use a writeback request to commit uncacheable (UC) data beforeprocessing forward and allows the Coherence Agent to writeback partialcache lines instead of protocol supporting a partial implicit writebackfor forwards.

In one embodiment, a read invalidate (RdInv) request acceptingExclusive-state data is supported. Semantics of uncacheable (UC) readsinclude flushing modified data to memory. Some architecture, however,allowed forwarding M data to invalidating reads, which forced therequesting agent to clean the line if it received M data. The RdInvsimplifies the flow but it does not allow E data to be forwarded.

In one embodiment, HPI support an InvItoM to IODC functionality. AnInvItoM requests exclusive ownership of a cache line without receivingdata and with the intent of performing a writeback soon afterward. Arequired cache state may be an M state, and E state, or either.

In one embodiment, HPI supports a WbFlush for persistent memory flush.An embodiment of a WbFlush is illustrated below. It may be sent as aresult of a persistent commit. May flush write to persistent memory.

In one embodiment, HPI supports additional operations, such as SnpF for“fanout” snoops generated by the Routing Layer. Some architectures don'thave explicit support for fanout snoops. Here, a HPI Home agentgenerates single “fanout” snoop request and, in response, the RoutingLayer generates snoops to all peer agents in the “fanout cone”. Homeagent may expect snoop responses from each of the agent Sections.

In one embodiment, HPI supports additional operations, such as SnpF for“fanout” snoops generated by the Routing Layer. Some architectures don'thave explicit support for fanout snoops. Here, a HPI Home agentgenerates single “fanout” snoop request and, in response, the RoutingLayer generates snoops to all peer agents in the “fanout cone”. Homeagent may expect snoop responses from each of the agent Sections.

In one embodiment, HPI supports an explicit writeback with cache-pushhint (WbPushMtol). In one embodiment, a Coherence Agent writes backmodified data with a hint to Home Agent that it may push the modifieddata to a “local” cache, storing in M state, without writing the data tomemory.

In one embodiment, a Coherence Agent may keep F state when forwardingshared data. In on example, a Coherence Agent with F state that receivesa “sharing” snoop or forward after such a snoop may keep the F statewhile sending S state to the requesting agent.

In one embodiment, protocol tables may be nested by having one tablerefer to another sub-table in the “next state” columns, and the nestedtable can have additional or finer-grained guards to specify which rows(behaviors) are permitted.

In one embodiment, Protocol tables use row spanning to indicate equallypermissible behaviors (rows) instead of adding “Bias” bits to selectamong behaviors.

In one embodiment, action tables are organized for use as functionalityengine for BFM (validation environment tool) rather than having BFM teamcreate their own BFM engine based upon their interpretation.

HPI Non-Coherent Protocol

In one embodiment, HPI supports non-coherent transactions. As anexample, a non-coherent transaction is referred to as one that does notparticipate in the HPI coherency protocol. Non-coherent transactionscomprise requests and their corresponding completions. For some specialtransactions, a broadcast mechanism.

Centering in HPI

In one embodiment, when the HPI is brought up from a powered-down state,the link must be “trained” before it can function at its top capacity.This is because values may “drift” over time and between varyingconditions, such as temperature. With a high-speed link like HPI, it isnecessary to have signals properly centered in both the time domain andthe voltage domain to avoid bit errors that may be introduced byparameter drift.

Training may include “centering” or “recentering” the clock to ensurethat signals are properly centered in both the time domain and voltagedomain. At a given speed, the clock has a window in which a sample of adata line will yield a correct value. Sampling outside the window mayyield a bit error. The faster the clock, the smaller the window, andvice versa. Thus, an important aspect of training in one example, andespecially in a high-speed interconnect with a narrow window, isshifting the Vref and phase of the clock so that data are sampled at ornear the center of the window to minimize bit errors. However, with atwo-dimensional parameter shift as described herein, challenges arise inselecting the optimal value on both axes.

In one example, training includes operating the HPI at a reduced speedinitially, such as half speed, feeding the HPI a known value such as aPRBS, and then sampling back the bit pattern. After a sample, the clockmay be shifted either in the voltage domain (Vref) or in the time domain(phase). The HPI detects when bit errors begin to occur, thus probingthe boundaries of the eye.

Centering may include a combination of both hardware and software(running, for example, from a basic input-output system (BIOS) chip). Inone example, hardware is provided for basic or initial centeringoperations, which may provide a rough centering solution. Software maythen be used to supplement and refine the initial centering. Softwarecentering provides additional flexibility, and in some cases providesgreater programmability of logic as compared to hardware centering. Thiscan address issues such as, for example, hardware centering finding whatit believes is a “near center” for the eye, when in fact an even nearercenter is available via additional passes.

In one example, the hardware includes 32 quantized delay settings forphase adjustment, though any number may be provided. Vref settings maybe similarly quantized.

Testing involves a sweep of a quantized setting across each lane. Aftereach sweep, an error detector enumerates the number of circularredundancy check (CRC) errors, if any, that were encountered during thesweep. In one example, each sweep is aggregated. Thus, the sweep isscored not on the number of CRC errors on each lane, but the number ofCRC errors on all lanes. This means that in some cases, a setting thatis the best for an individual lane may not be the best for theinterconnect as a whole.

The phase sweep may be performed in hardware at initial bootup, and maybe used to perform a rough centering. After the sweep is complete,software instructions may be loaded from BIOS to continue refiningcentering.

In a second phase, performed in one example in software, the Vref valueis similarly swept across quantized settings. As before, each sweepresults in zero or more CRC errors, and the result of each quantizedsetting is aggregated. This sweep is performed at operational speed (8Ghz in one example) to ensure that the results are valid for operationalspeeds.

In a third phase, software may construct a two-dimensional “eye,” or azone based on a cross section of the optimal values identified in thefirst two phases. The eye is an oblong or ovular zone of “best guessvalues.” In this phase, phase and Vref are tested together, and theresult of each phase and reference voltage pair is compared to everyother phase and reference voltage pair.

Optimality decisions within the eye may be non-trivial, since eyeopening may be asymmetric, non-monotonic around the major inflectionpoints, and somewhat time-variant. This is an example of Tx adaptation,i.e. Tx values are adjusted based on remote Rx metrics which are madeavailable to Tx on a backchannel. In HPI software typically running on acore on the upstream die can access the local die and remote die usingthe HPI sideband, which serves as the backchannel. In HPI, suchadaptation happen in both directions simultaneously since thebackchannel is not on the same wire as the link layer.

FIG. 4 is a more detailed link state machine diagram, illustrating atleast some of the link states and link state transitions that can beincluded in an example HPI controller. In some implementations, anexample link state machine can include, among the other states and statetransitions illustrated in FIG. 4, a “Directed Loopback” transition canbe provided to place the lanes into a digital loopback. For instance,the receiver lanes can be looped back to the transmitter lanes after theclock recovery circuits. A “Center” and an “LB_Recenter” state can alsobe provided in some instances, which can be used to align the datasymbols as described in this Specification.

The error detection described above may be enhanced by providing across-talk pattern, as illustrated in FIGS. 5 and 5A. It can be seen inthis example that a test of one lane comprises selecting that lane as a“victim” lane. A test pattern may be driven on that lane, including forexample and PRBS. Adjacent lanes, as well as lanes up to n lanes away(in this example, n=4) are “aggressor” lanes. These lanes receive acrosstalk pattern, which in this case is a logical inverse of the testpattern. Remaining lanes are neutral.

FIG. 6 is a flow chart of centering as described in this Specification.

In block 610, the interconnect awakes, such as coming up for boot aftera machine has been turned off.

In block 620, the interconnect performs initial phase centering asdescribed above. This may include performing a phase sweep in hardware,and selecting the setting that results in the fewest overall CRC biterrors.

In block 640, once rough phase centering is completed in hardware, theHPI may be brought to its full speed.

In block 650, the software may perform voltage centering. In certainexamples, the software may also refine phase centering as describedherein.

In block 670, an eye is constructed in software.

In block 680, eye centering is performed. As described above, this is atwo-dimensional centering method, in which phase and reference voltagepairs are selected and compared to one another. The method is then done.

In certain examples, an operation known as “recentering” may also occur.In recentering, flits stop, and phits take over the interconnect.Because of this, and because centering may take several microseconds(unacceptably slow for an HPI in certain embodiments), recenteringcannot be performed on a periodic basis, as in certain otherinterconnects. Rather, recentering may be episodic.

Specifically, recentering may occur when an error tracker in the HPIlink layer detects that the number of CRC errors received in a span oftime is greater than a threshold value. For example, a CRC error onceevery 10¹² bits may be acceptable. But more than that may be anindication of a true error. Thus, the receiving agent may send asideband message informing the transmitting agent that recentering isnecessary. When that occurs, the sending agent acknowledges the message,and the two agents enter recentering.

The message on the sideband may be a link control packet (LCP), which isa special class of packets sent on the HPI sideband. The sideband mayoperate at a speed orders of magnitude slower than the link layer. Forexample, the HPI sideband may operate at 100 to 400 MHz.

In certain example, recentering may be hardware only, as the BIOS maynot be available when recentering occurs.

Some R-link designs may opt to do low frequency or continuous CDRtracking using signaling on the data lanes which consists offlits/packets which are scrambled with a PRBS23. During quiet periodswhen there is not enough packets, the PHY could insert dummy LCPs so thetracking can be maintained.

Note that the apparatus′, methods′, and systems described above may beimplemented in any electronic device or system as aforementioned. Asspecific illustrations, the figures below provide exemplary systems forutilizing the invention as described herein. As the systems below aredescribed in more detail, a number of different interconnects aredisclosed, described, and revisited from the discussion above. And as isreadily apparent, the advances described above may be applied to any ofthose interconnects, fabrics, or architectures.

Referring now to FIG. 7, shown is a block diagram of an embodiment of amulticore processor. As shown in the embodiment of FIG. 7, processor 700includes multiple domains. Specifically, a core domain 730 includes aplurality of cores 730A-730N, a graphics domain 760 includes one or moregraphics engines having a media engine 765, and a system agent domain710.

In various embodiments, system agent domain 710 handles power controlevents and power management, such that individual units of domains 730and 760 (e.g. cores and/or graphics engines) are independentlycontrollable to dynamically operate at an appropriate power mode/level(e.g. active, turbo, sleep, hibernate, deep sleep, or other AdvancedConfiguration Power Interface like state) in light of the activity (orinactivity) occurring in the given unit. Each of domains 730 and 760 mayoperate at different voltage and/or power, and furthermore theindividual units within the domains each potentially operate at anindependent frequency and voltage. Note that while only shown with threedomains, understand the scope of the present invention is not limited inthis regard and additional domains may be present in other embodiments.

As shown, each core 730 further includes low level caches in addition tovarious execution units and additional processing elements. Here, thevarious cores are coupled to each other and to a shared cache memorythat is formed of a plurality of units or slices of a last level cache(LLC) 740A-740N; these LLCs often include storage and cache controllerfunctionality and are shared amongst the cores, as well as potentiallyamong the graphics engine too.

As seen, a ring interconnect 750 couples the cores together, andprovides interconnection between the core domain 730, graphics domain760 and system agent circuitry 710, via a plurality of ring stops752A-752N, each at a coupling between a core and LLC slice. As seen inFIG. 7, interconnect 750 is used to carry various information, includingaddress information, data information, acknowledgement information, andsnoop/invalid information. Although a ring interconnect is illustrated,any known on-die interconnect or fabric may be utilized. As anillustrative example, some of the fabrics discussed above (e.g. anotheron-die interconnect, Intel On-chip System Fabric (IOSF), an AdvancedMicrocontroller Bus Architecture (AMBA) interconnect, amulti-dimensional mesh fabric, or other known interconnect architecture)may be utilized in a similar fashion.

As further depicted, system agent domain 710 includes display engine 712which is to provide control of and an interface to an associateddisplay. System agent domain 710 may include other units, such as: anintegrated memory controller 720 that provides for an interface to asystem memory (e.g., a DRAM implemented with multiple DIMMs; coherencelogic 722 to perform memory coherence operations. Multiple interfacesmay be present to enable interconnection between the processor and othercircuitry. For example, in one embodiment at least one direct mediainterface (DMI) 716 interface is provided as well as one or more PCIe™interfaces 714. The display engine and these interfaces typically coupleto memory via a PCIe™ bridge 718. Still further, to provide forcommunications between other agents, such as additional processors orother circuitry, one or more other interfaces (e.g. an Intel® Quick PathInterconnect (QPI) fabric) may be provided.

Referring now to FIG. 8, shown is a block diagram of a representativecore; specifically, logical blocks of a back-end of a core, such as core730 from FIG. 7. In general, the structure shown in FIG. 8 includes anout-of-order processor that has a front end unit 870 used to fetchincoming instructions, perform various processing (e.g. caching,decoding, branch predicting, etc.) and passing instructions/operationsalong to an out-of-order (OOO) engine 880. OOO engine 880 performsfurther processing on decoded instructions.

Specifically in the embodiment of FIG. 8, out-of-order engine 880includes an allocate unit 882 to receive decoded instructions, which maybe in the form of one or more micro-instructions or uops, from front endunit 870, and allocate them to appropriate resources such as registersand so forth. Next, the instructions are provided to a reservationstation 884, which reserves resources and schedules them for executionon one of a plurality of execution units 886A-886N. Various types ofexecution units may be present, including, for example, arithmetic logicunits (ALUs), load and store units, vector processing units (VPUs),floating point execution units, among others. Results from thesedifferent execution units are provided to a reorder buffer (ROB) 888,which take unordered results and return them to correct program order.

Still referring to FIG. 8, note that both front end unit 870 andout-of-order engine 880 are coupled to different levels of a memoryhierarchy. Specifically shown is an instruction level cache 872, that inturn couples to a mid-level cache 876, that in turn couples to a lastlevel cache 895. In one embodiment, last level cache 895 is implementedin an on-chip (sometimes referred to as uncore) unit 890. As an example,unit 890 is similar to system agent 710 of FIG. 7. As discussed above,UnCore 890 communicates with system memory 899, which, in theillustrated embodiment, is implemented via ED RAM. Note also that thevarious execution units 886 within out-of-order engine 880 are incommunication with a first level cache 874 that also is in communicationwith mid-level cache 876. Note also that additional cores 830N-2-830Ncan couple to LLC 895. Although shown at this high level in theembodiment of FIG. 8, understand that various alterations and additionalcomponents may be present.

Turning to FIG. 9, a block diagram of an exemplary computer systemformed with a processor that includes execution units to execute aninstruction, where one or more of the interconnects implement one ormore features in accordance with one embodiment of the present inventionis illustrated. System 900 includes a component, such as a processor 902to employ execution units including logic to perform algorithms forprocess data, in accordance with the present invention, such as in theembodiment described herein. System 900 is representative of processingsystems based on the PENTIUM III™, PENTIUM 4™, Xeon™, Itanium, XScale™and/or StrongARM™ microprocessors available from Intel Corporation ofSanta Clara, Calif., although other systems (including PCs having othermicroprocessors, engineering workstations, set-top boxes and the like)may also be used. In one embodiment, sample system 900 executes aversion of the WINDOWS™ operating system available from MicrosoftCorporation of Redmond, Wash., although other operating systems (UNIXand Linux for example), embedded software, and/or graphical userinterfaces, may also be used. Thus, embodiments of the present inventionare not limited to any specific combination of hardware circuitry andsoftware.

Embodiments are not limited to computer systems. Alternative embodimentsof the present invention can be used in other devices such as handhelddevices and embedded applications. Some examples of handheld devicesinclude cellular phones, Internet Protocol devices, digital cameras,personal digital assistants (PDAs), and handheld PCs. Embeddedapplications can include a micro controller, a digital signal processor(DSP), system on a chip, network computers (NetPC), set-top boxes,network hubs, wide area network (WAN) switches, or any other system thatcan perform one or more instructions in accordance with at least oneembodiment.

In this illustrated embodiment, processor 902 includes one or moreexecution units 908 to implement an algorithm that is to perform atleast one instruction. One embodiment may be described in the context ofa single processor desktop or server system, but alternative embodimentsmay be included in a multiprocessor system. System 900 is an example ofa ‘hub’ system architecture. The computer system 900 includes aprocessor 902 to process data signals. The processor 902, as oneillustrative example, includes a complex instruction set computer (CISC)microprocessor, a reduced instruction set computing (RISC)microprocessor, a very long instruction word (VLIW) microprocessor, aprocessor implementing a combination of instruction sets, or any otherprocessor device, such as a digital signal processor, for example. Theprocessor 902 is coupled to a processor bus 910 that transmits datasignals between the processor 902 and other components in the system900. The elements of system 900 (e.g. graphics accelerator 912, memorycontroller hub 916, memory 920, I/O controller hub 924, wirelesstransceiver 926, Flash BIOS 928, Network controller 934, Audiocontroller 936, Serial expansion port 938, I/O controller 940, etc.)perform their conventional functions that are well known to thosefamiliar with the art.

In one embodiment, the processor 902 includes a Level 1 (L1) internalcache memory 904. Depending on the architecture, the processor 902 mayhave a single internal cache or multiple levels of internal caches.Other embodiments include a combination of both internal and externalcaches depending on the particular implementation and needs. Registerfile 906 is to store different types of data in various registersincluding integer registers, floating point registers, vector registers,banked registers, shadow registers, checkpoint registers, statusregisters, and instruction pointer register.

Execution unit 908, including logic to perform integer and floatingpoint operations, also resides in the processor 902. The processor 902,in one embodiment, includes a microcode (ucode) ROM to store microcode,which when executed, is to perform algorithms for certainmacroinstructions or handle complex scenarios. Here, microcode ispotentially updateable to handle logic bugs/fixes for processor 902. Forone embodiment, execution unit 908 includes logic to handle a packedinstruction set 909. By including the packed instruction set 909 in theinstruction set of a general-purpose processor 902, along withassociated circuitry to execute the instructions, the operations used bymany multimedia applications may be performed using packed data in ageneral-purpose processor 902. Thus, many multimedia applications areaccelerated and executed more efficiently by using the full width of aprocessor's data bus for performing operations on packed data. Thispotentially eliminates the need to transfer smaller units of data acrossthe processor's data bus to perform one or more operations, one dataelement at a time.

Alternate embodiments of an execution unit 908 may also be used in microcontrollers, embedded processors, graphics devices, DSPs, and othertypes of logic circuits. System 900 includes a memory 920. Memory 920includes a dynamic random access memory (DRAM) device, a static randomaccess memory (SRAM) device, flash memory device, or other memorydevice. Memory 920 stores instructions and/or data represented by datasignals that are to be executed by the processor 902.

Note that any of the aforementioned features or aspects of the inventionmay be utilized on one or more interconnect illustrated in FIG. 9. Forexample, an on-die interconnect (ODI), which is not shown, for couplinginternal units of processor 902 implements one or more aspects of theinvention described above. Or the invention is associated with aprocessor bus 910 (e.g. Intel Quick Path Interconnect (QPI) or otherknown high performance computing interconnect), a high bandwidth memorypath 918 to memory 920, a point-to-point link to graphics accelerator912 (e.g. a Peripheral Component Interconnect express (PCIe) compliantfabric), a controller hub interconnect 922, an I/O or other interconnect(e.g. USB, PCI, PCIe) for coupling the other illustrated components.Some examples of such components include the audio controller 936,firmware hub (flash BIOS) 928, wireless transceiver 926, data storage924, legacy I/O controller 910 containing user input and keyboardinterfaces 942, a serial expansion port 938 such as Universal Serial Bus(USB), and a network controller 934. The data storage device 924 cancomprise a hard disk drive, a floppy disk drive, a CD-ROM device, aflash memory device, or other mass storage device.

Referring now to FIG. 10, shown is a block diagram of a second system1000 in accordance with an embodiment of the present invention. As shownin FIG. 10, multiprocessor system 1000 is a point-to-point interconnectsystem, and includes a first processor 1070 and a second processor 1080coupled via a point-to-point interconnect 1050. Each of processors 1070and 1080 may be some version of a processor. In one embodiment, 1052 and1054 are part of a serial, point-to-point coherent interconnect fabric,such as Intel's Quick Path Interconnect (QPI) architecture. As a result,the invention may be implemented within the QPI architecture.

While shown with only two processors 1070, 1080, it is to be understoodthat the scope of the present invention is not so limited. In otherembodiments, one or more additional processors may be present in a givenprocessor.

Processors 1070 and 1080 are shown including integrated memorycontroller units 1072 and 1082, respectively. Processor 1070 alsoincludes as part of its bus controller units point-to-point (P-P)interfaces 1076 and 1078; similarly, second processor 1080 includes P-Pinterfaces 1086 and 1088. Processors 1070, 1080 may exchange informationvia a point-to-point (P-P) interface 1050 using P-P interface circuits1078, 1088. As shown in FIG. 10, IMCs 1072 and 1082 couple theprocessors to respective memories, namely a memory 1032 and a memory1034, which may be portions of main memory locally attached to therespective processors.

Processors 1070, 1080 each exchange information with a chipset 1090 viaindividual P-P interfaces 1052, 1054 using point to point interfacecircuits 1076, 1094, 1086, 1098. Chipset 1090 also exchanges informationwith a high-performance graphics circuit 1038 via an interface circuit1092 along a high-performance graphics interconnect 1039.

A shared cache (not shown) may be included in either processor oroutside of both processors; yet connected with the processors via P-Pinterconnect, such that either or both processors' local cacheinformation may be stored in the shared cache if a processor is placedinto a low power mode.

Chipset 1090 may be coupled to a first bus 1016 via an interface 1096.In one embodiment, first bus 1016 may be a Peripheral ComponentInterconnect (PCI) bus, or a bus such as a PCI Express bus or anotherthird generation I/O interconnect bus, although the scope of the presentinvention is not so limited.

As shown in FIG. 10, various I/O devices 1014 are coupled to first bus1016, along with a bus bridge 1018 which couples first bus 1016 to asecond bus 1020. In one embodiment, second bus 1020 includes a low pincount (LPC) bus. Various devices are coupled to second bus 1020including, for example, a keyboard and/or mouse 1022, communicationdevices 1027 and a storage unit 1028 such as a disk drive or other massstorage device which often includes instructions/code and data 1030, inone embodiment. Further, an audio I/O 1024 is shown coupled to secondbus 1020. Note that other architectures are possible, where the includedcomponents and interconnect architectures vary. For example, instead ofthe point-to-point architecture of FIG. 10, a system may implement amulti-drop bus or other such architecture.

Referring now to FIG. 11, a block diagram of components present in acomputer system in accordance with an embodiment of the presentinvention is illustrated. As shown in FIG. 11, system 1100 includes anycombination of components. These components may be implemented as ICs,portions thereof, discrete electronic devices, or other modules, logic,hardware, software, firmware, or a combination thereof adapted in acomputer system, or as components otherwise incorporated within achassis of the computer system. Note also that the block diagram of FIG.11 is intended to show a high level view of many components of thecomputer system. However, it is to be understood that some of thecomponents shown may be omitted, additional components may be present,and different arrangement of the components shown may occur in otherimplementations. As a result, the invention described above may beimplemented in any portion of one or more of the interconnectsillustrated or described below.

As seen in FIG. 11, a processor 1110, in one embodiment, includes amicroprocessor, multi-core processor, multithreaded processor, an ultralow voltage processor, an embedded processor, or other known processingelement. In the illustrated implementation, processor 1110 acts as amain processing unit and central hub for communication with many of thevarious components of the system 1100. As one example, processor 1100 isimplemented as a system on a chip (SoC). As a specific illustrativeexample, processor 1110 includes an Intel® Architecture Core™-basedprocessor such as an i3, i5, i7 or another such processor available fromIntel Corporation, Santa Clara, Calif. However, understand that otherlow power processors such as available from Advanced Micro Devices, Inc.(AMD) of Sunnyvale, Calif., a MIPS-based design from MIPS Technologies,Inc. of Sunnyvale, Calif., an ARM-based design licensed from ARMHoldings, Ltd. or customer thereof, or their licensees or adopters mayinstead be present in other embodiments such as an Apple A5/A6processor, a Qualcomm Snapdragon processor, or TI OMAP processor. Notethat many of the customer versions of such processors are modified andvaried; however, they may support or recognize a specific instructionsset that performs defined algorithms as set forth by the processorlicensor. Here, the microarchitectural implementation may vary, but thearchitectural function of the processor is usually consistent. Certaindetails regarding the architecture and operation of processor 1110 inone implementation will be discussed further below to provide anillustrative example.

Processor 1110, in one embodiment, communicates with a system memory1115. As an illustrative example, which in an embodiment can beimplemented via multiple memory devices to provide for a given amount ofsystem memory. As examples, the memory can be in accordance with a JointElectron Devices Engineering Council (JEDEC) low power double data rate(LPDDR)-based design such as the current LPDDR2 standard according toJEDEC JESD 209-2E (published April 2009), or a next generation LPDDRstandard to be referred to as LPDDR3 or LPDDR4 that will offerextensions to LPDDR2 to increase bandwidth. In various implementationsthe individual memory devices may be of different package types such assingle die package (SDP), dual die package (DDP) or quad die package(9P). These devices, in some embodiments, are directly soldered onto amotherboard to provide a lower profile solution, while in otherembodiments the devices are configured as one or more memory modulesthat in turn couple to the motherboard by a given connector. And ofcourse, other memory implementations are possible such as other types ofmemory modules, e.g., dual inline memory modules (DIMMs) of differentvarieties including but not limited to microDIMMs, MiniDIMMs. In aparticular illustrative embodiment, memory is sized between 2 GB and 16GB, and may be configured as a DDR3LM package or an LPDDR2 or LPDDR3memory that is soldered onto a motherboard via a ball grid array (BGA).

To provide for persistent storage of information such as data,applications, one or more operating systems and so forth, a mass storage1120 may also couple to processor 1110. In various embodiments, toenable a thinner and lighter system design as well as to improve systemresponsiveness, this mass storage may be implemented via a SSD. Howeverin other embodiments, the mass storage may primarily be implementedusing a hard disk drive (HDD) with a smaller amount of SSD storage toact as a SSD cache to enable non-volatile storage of context state andother such information during power down events so that a fast power upcan occur on re-initiation of system activities. Also shown in FIG. 11,a flash device 1122 may be coupled to processor 1110, e.g., via a serialperipheral interface (SPI). This flash device may provide fornon-volatile storage of system software, including a basic input/outputsoftware (BIOS) as well as other firmware of the system.

In various embodiments, mass storage of the system is implemented by aSSD alone or as a disk, optical or other drive with an SSD cache. Insome embodiments, the mass storage is implemented as a SSD or as a HDDalong with a restore (RST) cache module. In various implementations, theHDD provides for storage of between 320 GB-4 terabytes (TB) and upwardwhile the RST cache is implemented with a SSD having a capacity of 24GB-256 GB. Note that such SSD cache may be configured as a single levelcache (SLC) or multi-level cache (MLC) option to provide an appropriatelevel of responsiveness. In a SSD-only option, the module may beaccommodated in various locations such as in a mSATA or NGFF slot. As anexample, an SSD has a capacity ranging from 120 GB-1 TB.

Various input/output (IO) devices may be present within system 1100.Specifically shown in the embodiment of FIG. 11 is a display 1124 whichmay be a high definition LCD or LED panel configured within a lidportion of the chassis. This display panel may also provide for a touchscreen 1125, e.g., adapted externally over the display panel such thatvia a user's interaction with this touch screen, user inputs can beprovided to the system to enable desired operations, e.g., with regardto the display of information, accessing of information and so forth. Inone embodiment, display 1124 may be coupled to processor 1110 via adisplay interconnect that can be implemented as a high performancegraphics interconnect. Touch screen 1125 may be coupled to processor1110 via another interconnect, which in an embodiment can be an I²Cinterconnect. As further shown in FIG. 11, in addition to touch screen1125, user input by way of touch can also occur via a touch pad 1130which may be configured within the chassis and may also be coupled tothe same I²C interconnect as touch screen 1125.

The display panel may operate in multiple modes. In a first mode, thedisplay panel can be arranged in a transparent state in which thedisplay panel is transparent to visible light. In various embodiments,the majority of the display panel may be a display except for a bezelaround the periphery. When the system is operated in a notebook mode andthe display panel is operated in a transparent state, a user may viewinformation that is presented on the display panel while also being ableto view objects behind the display. In addition, information displayedon the display panel may be viewed by a user positioned behind thedisplay. Or the operating state of the display panel can be an opaquestate in which visible light does not transmit through the displaypanel.

In a tablet mode the system is folded shut such that the back displaysurface of the display panel comes to rest in a position such that itfaces outwardly towards a user, when the bottom surface of the basepanel is rested on a surface or held by the user. In the tablet mode ofoperation, the back display surface performs the role of a display anduser interface, as this surface may have touch screen functionality andmay perform other known functions of a conventional touch screen device,such as a tablet device. To this end, the display panel may include atransparency-adjusting layer that is disposed between a touch screenlayer and a front display surface. In some embodiments thetransparency-adjusting layer may be an electrochromic layer (EC), a LCDlayer, or a combination of EC and LCD layers.

In various embodiments, the display can be of different sizes, e.g., an11.6″ or a 13.3″ screen, and may have a 16:9 aspect ratio, and at least300 nits brightness. Also the display may be of full high definition(HD) resolution (at least 1920×1080p), be compatible with an embeddeddisplay port (eDP), and be a low power panel with panel self refresh.

As to touch screen capabilities, the system may provide for a displaymulti-touch panel that is multi-touch capacitive and being at least 5finger capable. And in some embodiments, the display may be 10 fingercapable. In one embodiment, the touch screen is accommodated within adamage and scratch-resistant glass and coating (e.g., Gorilla Glass™ orGorilla Glass2™) for low friction to reduce “finger burn” and avoid“finger skipping”. To provide for an enhanced touch experience andresponsiveness, the touch panel, in some implementations, hasmulti-touch functionality, such as less than 2 frames (30 Hz) per staticview during pinch zoom, and single-touch functionality of less than 1 cmper frame (30 Hz) with 200 ms (lag on finger to pointer). The display,in some implementations, supports edge-to-edge glass with a minimalscreen bezel that is also flush with the panel surface, and limited IOinterference when using multi-touch.

For perceptual computing and other purposes, various sensors may bepresent within the system and may be coupled to processor 1110 indifferent manners. Certain inertial and environmental sensors may coupleto processor 1110 through a sensor hub 1140, e.g., via an I²Cinterconnect. In the embodiment shown in FIG. 11, these sensors mayinclude an accelerometer 1141, an ambient light sensor (ALS) 1142, acompass 1143 and a gyroscope 1144. Other environmental sensors mayinclude one or more thermal sensors 1146 which in some embodimentscouple to processor 1110 via a system management bus (SMBus) bus.

Using the various inertial and environmental sensors present in aplatform, many different use cases may be realized. These use casesenable advanced computing operations including perceptual computing andalso allow for enhancements with regard to power management/batterylife, security, and system responsiveness.

For example with regard to power management/battery life issues, basedat least on part on information from an ambient light sensor, theambient light conditions in a location of the platform are determinedand intensity of the display controlled accordingly. Thus, powerconsumed in operating the display is reduced in certain lightconditions.

As to security operations, based on context information obtained fromthe sensors such as location information, it may be determined whether auser is allowed to access certain secure documents. For example, a usermay be permitted to access such documents at a work place or a homelocation. However, the user is prevented from accessing such documentswhen the platform is present at a public location. This determination,in one embodiment, is based on location information, e.g., determinedvia a GPS sensor or camera recognition of landmarks. Other securityoperations may include providing for pairing of devices within a closerange of each other, e.g., a portable platform as described herein and auser's desktop computer, mobile telephone or so forth. Certain sharing,in some implementations, are realized via near field communication whenthese devices are so paired. However, when the devices exceed a certainrange, such sharing may be disabled. Furthermore, when pairing aplatform as described herein and a smartphone, an alarm may beconfigured to be triggered when the devices move more than apredetermined distance from each other, when in a public location. Incontrast, when these paired devices are in a safe location, e.g., a workplace or home location, the devices may exceed this predetermined limitwithout triggering such alarm.

Responsiveness may also be enhanced using the sensor information. Forexample, even when a platform is in a low power state, the sensors maystill be enabled to run at a relatively low frequency. Accordingly, anychanges in a location of the platform, e.g., as determined by inertialsensors, GPS sensor, or so forth is determined. If no such changes havebeen registered, a faster connection to a previous wireless hub such asa Wi-Fi™ access point or similar wireless enabler occurs, as there is noneed to scan for available wireless network resources in this case.Thus, a greater level of responsiveness when waking from a low powerstate is achieved.

It is to be understood that many other use cases may be enabled usingsensor information obtained via the integrated sensors within a platformas described herein, and the above examples are only for purposes ofillustration. Using a system as described herein, a perceptual computingsystem may allow for the addition of alternative input modalities,including gesture recognition, and enable the system to sense useroperations and intent.

In some embodiments one or more infrared or other heat sensing elements,or any other element for sensing the presence or movement of a user maybe present. Such sensing elements may include multiple differentelements working together, working in sequence, or both. For example,sensing elements include elements that provide initial sensing, such aslight or sound projection, followed by sensing for gesture detection by,for example, an ultrasonic time of flight camera or a patterned lightcamera.

Also in some embodiments, the system includes a light generator toproduce an illuminated line. In some embodiments, this line provides avisual cue regarding a virtual boundary, namely an imaginary or virtuallocation in space, where action of the user to pass or break through thevirtual boundary or plane is interpreted as an intent to engage with thecomputing system. In some embodiments, the illuminated line may changecolors as the computing system transitions into different states withregard to the user. The illuminated line may be used to provide a visualcue for the user of a virtual boundary in space, and may be used by thesystem to determine transitions in state of the computer with regard tothe user, including determining when the user wishes to engage with thecomputer.

In some embodiments, the computer senses user position and operates tointerpret the movement of a hand of the user through the virtualboundary as a gesture indicating an intention of the user to engage withthe computer. In some embodiments, upon the user passing through thevirtual line or plane the light generated by the light generator maychange, thereby providing visual feedback to the user that the user hasentered an area for providing gestures to provide input to the computer.

Display screens may provide visual indications of transitions of stateof the computing system with regard to a user. In some embodiments, afirst screen is provided in a first state in which the presence of auser is sensed by the system, such as through use of one or more of thesensing elements.

In some implementations, the system acts to sense user identity, such asby facial recognition. Here, transition to a second screen may beprovided in a second state, in which the computing system has recognizedthe user identity, where this second the screen provides visual feedbackto the user that the user has transitioned into a new state. Transitionto a third screen may occur in a third state in which the user hasconfirmed recognition of the user.

In some embodiments, the computing system may use a transition mechanismto determine a location of a virtual boundary for a user, where thelocation of the virtual boundary may vary with user and context. Thecomputing system may generate a light, such as an illuminated line, toindicate the virtual boundary for engaging with the system. In someembodiments, the computing system may be in a waiting state, and thelight may be produced in a first color. The computing system may detectwhether the user has reached past the virtual boundary, such as bysensing the presence and movement of the user using sensing elements.

In some embodiments, if the user has been detected as having crossed thevirtual boundary (such as the hands of the user being closer to thecomputing system than the virtual boundary line), the computing systemmay transition to a state for receiving gesture inputs from the user,where a mechanism to indicate the transition may include the lightindicating the virtual boundary changing to a second color.

In some embodiments, the computing system may then determine whethergesture movement is detected. If gesture movement is detected, thecomputing system may proceed with a gesture recognition process, whichmay include the use of data from a gesture data library, which mayreside in memory in the computing device or may be otherwise accessed bythe computing device.

If a gesture of the user is recognized, the computing system may performa function in response to the input, and return to receive additionalgestures if the user is within the virtual boundary. In someembodiments, if the gesture is not recognized, the computing system maytransition into an error state, where a mechanism to indicate the errorstate may include the light indicating the virtual boundary changing toa third color, with the system returning to receive additional gesturesif the user is within the virtual boundary for engaging with thecomputing system.

As mentioned above, in other embodiments the system can be configured asa convertible tablet system that can be used in at least two differentmodes, a tablet mode and a notebook mode. The convertible system mayhave two panels, namely a display panel and a base panel such that inthe tablet mode the two panels are disposed in a stack on top of oneanother. In the tablet mode, the display panel faces outwardly and mayprovide touch screen functionality as found in conventional tablets. Inthe notebook mode, the two panels may be arranged in an open clamshellconfiguration.

In various embodiments, the accelerometer may be a 3-axis accelerometerhaving data rates of at least 50 Hz. A gyroscope may also be included,which can be a 3-axis gyroscope. In addition, an e-compass/magnetometermay be present. Also, one or more proximity sensors may be provided(e.g., for lid open to sense when a person is in proximity (or not) tothe system and adjust power/performance to extend battery life). Forsome OS's Sensor Fusion capability including the accelerometer,gyroscope, and compass may provide enhanced features. In addition, via asensor hub having a real-time clock (RTC), a wake from sensors mechanismmay be realized to receive sensor input when a remainder of the systemis in a low power state.

In some embodiments, an internal lid/display open switch or sensor toindicate when the lid is closed/open, and can be used to place thesystem into Connected Standby or automatically wake from ConnectedStandby state. Other system sensors can include ACPI sensors forinternal processor, memory, and skin temperature monitoring to enablechanges to processor and system operating states based on sensedparameters.

In an embodiment, the OS may be a Microsoft® Windows® 8 OS thatimplements Connected Standby (also referred to herein as Win8 CS).Windows 8 Connected Standby or another OS having a similar state canprovide, via a platform as described herein, very low ultra idle powerto enable applications to remain connected, e.g., to a cloud-basedlocation, at very low power consumption. The platform can supports 3power states, namely screen on (normal);

Connected Standby (as a default “off” state); and shutdown (zero wattsof power consumption). Thus in the Connected Standby state, the platformis logically on (at minimal power levels) even though the screen is off.In such a platform, power management can be made to be transparent toapplications and maintain constant connectivity, in part due to offloadtechnology to enable the lowest powered component to perform anoperation.

Also seen in FIG. 11, various peripheral devices may couple to processor1110 via a low pin count (LPC) interconnect. In the embodiment shown,various components can be coupled through an embedded controller 1135.Such components can include a keyboard 1136 (e.g., coupled via a PS2interface), a fan 1137, and a thermal sensor 1139. In some embodiments,touch pad 1130 may also couple to EC 1135 via a PS2 interface. Inaddition, a security processor such as a trusted platform module (TPM)1138 in accordance with the Trusted Computing Group (TCG) TPMSpecification Version 1.2, dated Oct. 2, 2003, may also couple toprocessor 1110 via this LPC interconnect. However, understand the scopeof the present invention is not limited in this regard and secureprocessing and storage of secure information may be in another protectedlocation such as a static random access memory (SRAM) in a securitycoprocessor, or as encrypted data blobs that are only decrypted whenprotected by a secure enclave (SE) processor mode.

In a particular implementation, peripheral ports may include a highdefinition media interface (HDMI) connector (which can be of differentform factors such as full size, mini or micro); one or more USB ports,such as full-size external ports in accordance with the Universal SerialBus Revision 3.0 Specification (November 2008), with at least onepowered for charging of USB devices (such as smartphones) when thesystem is in Connected Standby state and is plugged into AC wall power.In addition, one or more Thunderbolt™ ports can be provided. Other portsmay include an externally accessible card reader such as a full sizeSD-XC card reader and/or a SIM card reader for WWAN (e.g., an 8 pin cardreader). For audio, a 3.5 mm jack with stereo sound and microphonecapability (e.g., combination functionality) can be present, withsupport for jack detection (e.g., headphone only support usingmicrophone in the lid or headphone with microphone in cable). In someembodiments, this jack can be re-taskable between stereo headphone andstereo microphone input. Also, a power jack can be provided for couplingto an AC brick.

System 1100 can communicate with external devices in a variety ofmanners, including wirelessly. In the embodiment shown in FIG. 11,various wireless modules, each of which can correspond to a radioconfigured for a particular wireless communication protocol, arepresent. One manner for wireless communication in a short range such asa near field may be via a near field communication (NFC) unit 1145 whichmay communicate, in one embodiment with processor 1110 via an SMBus.Note that via this NFC unit 1145, devices in close proximity to eachother can communicate. For example, a user can enable system 1100 tocommunicate with another (e.g.,) portable device such as a smartphone ofthe user via adapting the two devices together in close relation andenabling transfer of information such as identification informationpayment information, data such as image data or so forth. Wireless powertransfer may also be performed using a NFC system.

Using the NFC unit described herein, users can bump devices side-to-sideand place devices side-by-side for near field coupling functions (suchas near field communication and wireless power transfer (WPT)) byleveraging the coupling between coils of one or more of such devices.More specifically, embodiments provide devices with strategicallyshaped, and placed, ferrite materials, to provide for better coupling ofthe coils. Each coil has an inductance associated with it, which can bechosen in conjunction with the resistive, capacitive, and other featuresof the system to enable a common resonant frequency for the system.

As further seen in FIG. 11, additional wireless units can include othershort range wireless engines including a WLAN unit 1150 and a Bluetoothunit 1152. Using WLAN unit 1150, Wi-Fi™ communications in accordancewith a given Institute of Electrical and Electronics Engineers (IEEE)802.11 standard can be realized, while via Bluetooth unit 1152, shortrange communications via a Bluetooth protocol can occur. These units maycommunicate with processor 1110 via, e.g., a USB link or a universalasynchronous receiver transmitter (UART) link. Or these units may coupleto processor 1110 via an interconnect according to a PeripheralComponent Interconnect Express™ (PCIe™) protocol, e.g., in accordancewith the PCI Express™ Specification Base Specification version 3.0(published Jan. 17, 2007), or another such protocol such as a serialdata input/output (SDIO) standard. Of course, the actual physicalconnection between these peripheral devices, which may be configured onone or more add-in cards, can be by way of the NGFF connectors adaptedto a motherboard.

In addition, wireless wide area communications, e.g., according to acellular or other wireless wide area protocol, can occur via a WWAN unit1156 which in turn may couple to a subscriber identity module (SIM)1157. In addition, to enable receipt and use of location information, aGPS module 1155 may also be present. Note that in the embodiment shownin FIG. 11, WWAN unit 1156 and an integrated capture device such as acamera module 1154 may communicate via a given USB protocol such as aUSB 2.0 or 3.0 link, or a UART or I²C protocol. Again the actualphysical connection of these units can be via adaptation of a NGFFadd-in card to an NGFF connector configured on the motherboard.

In a particular embodiment, wireless functionality can be providedmodularly, e.g., with a WiFi™ 802.11ac solution (e.g., add-in card thatis backward compatible with IEEE 802.11abgn) with support for Windows 8CS. This card can be configured in an internal slot (e.g., via an NGFFadapter). An additional module may provide for Bluetooth capability(e.g., Bluetooth 4.0 with backwards compatibility) as well as Intel®Wireless Display functionality. In addition NFC support may be providedvia a separate device or multi-function device, and can be positioned asan example, in a front right portion of the chassis for easy access. Astill additional module may be a WWAN device that can provide supportfor 3G/4G/LTE and GPS. This module can be implemented in an internal(e.g., NGFF) slot. Integrated antenna support can be provided for

Bluetooth, WWAN, NFC and GPS, enabling seamless transition from WiFi™ toWWAN radios, wireless gigabit (WiGig) in accordance with the WirelessGigabit Specification (July 2010), and vice versa.

As described above, an integrated camera can be incorporated in the lid.As one example, this camera can be a high resolution camera, e.g.,having a resolution of at least 2.0 megapixels (MP) and extending to 6.0MP and beyond.

To provide for audio inputs and outputs, an audio processor can beimplemented via a digital signal processor (DSP) 1160, which may coupleto processor 1110 via a high definition audio (HDA) link. Similarly, DSP1160 may communicate with an integrated coder/decoder (CODEC) andamplifier 1162 that in turn may couple to output speakers 1163 which maybe implemented within the chassis. Similarly, amplifier and CODEC 1162can be coupled to receive audio inputs from a microphone 1165 which inan embodiment can be implemented via dual array microphones (such as adigital microphone array) to provide for high quality audio inputs toenable voice-activated control of various operations within the system.Note also that audio outputs can be provided from amplifier/CODEC 1162to a headphone jack 1164. Although shown with these particularcomponents in the embodiment of FIG. 11, understand the scope of thepresent invention is not limited in this regard.

In a particular embodiment, the digital audio codec and amplifier arecapable of driving the stereo headphone jack, stereo microphone jack, aninternal microphone array and stereo speakers. In differentimplementations, the codec can be integrated into an audio DSP orcoupled via an HD audio path to a peripheral controller hub (PCH). Insome implementations, in addition to integrated stereo speakers, one ormore bass speakers can be provided, and the speaker solution can supportDTS audio.

In some embodiments, processor 1110 may be powered by an externalvoltage regulator (VR) and multiple internal voltage regulators that areintegrated inside the processor die, referred to as fully integratedvoltage regulators (FIVRs). The use of multiple FIVRs in the processorenables the grouping of components into separate power planes, such thatpower is regulated and supplied by the FIVR to only those components inthe group. During power management, a given power plane of one FIVR maybe powered down or off when the processor is placed into a certain lowpower state, while another power plane of another FIVR remains active,or fully powered.

In one embodiment, a sustain power plane can be used during some deepsleep states to power on the I/O pins for several I/O signals, such asthe interface between the processor and a PCH, the interface with theexternal VR and the interface with EC 1135. This sustain power planealso powers an on-die voltage regulator that supports the on-board SRAMor other cache memory in which the processor context is stored duringthe sleep state. The sustain power plane is also used to power on theprocessor's wakeup logic that monitors and processes the various wakeupsource signals.

During power management, while other power planes are powered down oroff when the processor enters certain deep sleep states, the sustainpower plane remains powered on to support the above-referencedcomponents. However, this can lead to unnecessary power consumption ordissipation when those components are not needed. To this end,embodiments may provide a connected standby sleep state to maintainprocessor context using a dedicated power plane. In one embodiment, theconnected standby sleep state facilitates processor wakeup usingresources of a PCH which itself may be present in a package with theprocessor. In one embodiment, the connected standby sleep statefacilitates sustaining processor architectural functions in the PCHuntil processor wakeup, this enabling turning off all of the unnecessaryprocessor components that were previously left powered on during deepsleep states, including turning off all of the clocks. In oneembodiment, the PCH contains a time stamp counter (TSC) and connectedstandby logic for controlling the system during the connected standbystate. The integrated voltage regulator for the sustain power plane mayreside on the PCH as well.

In an embodiment, during the connected standby state, an integratedvoltage regulator may function as a dedicated power plane that remainspowered on to support the dedicated cache memory in which the processorcontext is stored such as critical state variables when the processorenters the deep sleep states and connected standby state. This criticalstate may include state variables associated with the architectural,micro-architectural, debug state, and/or similar state variablesassociated with the processor.

The wakeup source signals from EC 1135 may be sent to the PCH instead ofthe processor during the connected standby state so that the PCH canmanage the wakeup processing instead of the processor. In addition, theTSC is maintained in the PCH to facilitate sustaining processorarchitectural functions. Although shown with these particular componentsin the embodiment of FIG. 11, understand the scope of the presentinvention is not limited in this regard.

Power control in the processor can lead to enhanced power savings. Forexample, power can be dynamically allocate between cores, individualcores can change frequency/voltage, and multiple deep low power statescan be provided to enable very low power consumption. In addition,dynamic control of the cores or independent core portions can providefor reduced power consumption by powering off components when they arenot being used.

Some implementations may provide a specific power management IC (PMIC)to control platform power. Using this solution, a system may see verylow (e.g., less than 5%) battery degradation over an extended duration(e.g., 16 hours) when in a given standby state, such as when in a Win8Connected Standby state. In a Win8 idle state a battery life exceeding,e.g., 9 hours may be realized (e.g., at 150 nits). As to video playback,a long battery life can be realized, e.g., full HD video playback canoccur for a minimum of 6 hours. A platform in one implementation mayhave an energy capacity of, e.g., 35 watt hours (Whr) for a Win8 CSusing an SSD and (e.g.,) 40-44 Whr for Win8 CS using an HDD with a RSTcache configuration.

A particular implementation may provide support for 15 W nominal CPUthermal design power (TDP), with a configurable CPU TDP of up toapproximately 25 W TDP design point. The platform may include minimalvents owing to the thermal features described above. In addition, theplatform is pillow-friendly (in that no hot air is blowing at the user).Different maximum temperature points can be realized depending on thechassis material. In one implementation of a plastic chassis (at leasthaving to lid or base portion of plastic), the maximum operatingtemperature can be 52 degrees Celsius (C). And for an implementation ofa metal chassis, the maximum operating temperature can be 46° C.

In different implementations, a security module such as a TPM can beintegrated into a processor or can be a discrete device such as a TPM2.0 device. With an integrated security module, also referred to asPlatform Trust Technology (PTT), BIOS/firmware can be enabled to exposecertain hardware features for certain security features, includingsecure instructions, secure boot, Intel® Anti-Theft Technology, Intel®Identity Protection Technology, Intel® Trusted Execution Technology(TXT), and Intel® Manageability Engine Technology along with secure userinterfaces such as a secure keyboard and display.

Turning next to FIG. 12, an embodiment of a system on-chip (SOC) designin accordance with the inventions is depicted. As a specificillustrative example, SOC 1200 is included in user equipment (UE). Inone embodiment, UE refers to any device to be used by an end-user tocommunicate, such as a hand-held phone, smartphone, tablet, ultra-thinnotebook, notebook with broadband adapter, or any other similarcommunication device. Often a UE connects to a base station or node,which potentially corresponds in nature to a mobile station (MS) in aGSM network.

Here, SOC 1200 includes 2 cores-1206 and 1207. Similar to the discussionabove, cores 1206 and 1207 may conform to an Instruction SetArchitecture, such as an Intel® Architecture Core™-based processor, anAdvanced Micro Devices, Inc. (AMD) processor, a MIPS-based processor, anARM-based processor design, or a customer thereof, as well as theirlicensees or adopters. Cores 1206 and 1207 are coupled to cache control1208 that is associated with bus interface unit 1209 and L2 cache 1210to communicate with other parts of system 1200. Interconnect 1210includes an on-chip interconnect, such as an IOSF, AMBA, or otherinterconnect discussed above, which potentially implements one or moreaspects of the described invention.

Interface 1210 provides communication channels to the other components,such as a Subscriber Identity Module (SIM) 1230 to interface with a SIMcard, a boot rom 1235 to hold boot code for execution by cores 1206 and1207 to initialize and boot SOC 1200, a SDRAM controller 1240 tointerface with external memory (e.g. DRAM 1260), a flash controller 1245to interface with non-volatile memory (e.g. Flash 1265), a peripheralcontrol 850 (e.g. Serial Peripheral Interface) to interface withperipherals, video codecs 1220 and Video interface 1225 to display andreceive input (e.g. touch enabled input), GPU 1215 to perform graphicsrelated computations, etc. Any of these interfaces may incorporateaspects of the invention described herein.

In addition, the system illustrates peripherals for communication, suchas a Bluetooth module 1270, 3G modem 1275, GPS 1285, and WiFi 1285. Noteas stated above, a UE includes a radio for communication. As a result,these peripheral communication modules are not all required. However, ina UE some form a radio for external communication is to be included.

The following examples pertain to embodiments in accordance with thisSpecification. One or more embodiments may provide an apparatus, asystem, a machine readable storage, a machine readable medium, hardware-and/or software-based logic, and a method to generate a clock signal; tophase shift the clock signal by a test phase; to measure an error rateof the test phase; and to select an operational phase of the clocksignal based at least in part on the error rate of the test phase.

In at least one example, the phase shifter is a quantized phase shifter.

In at least one example, an interconnect apparatus further comprises anerror comparator, wherein the test phase is a first test phase, andwherein:

In at least one example, the phase shifter is further to shift the clocksignal by a second test phase;

In at least one example, the error rate detector is further to measurean error of the second test phase; and

In at least one example, the error comparator is to compare the errorrate of the first test phase to the error rate of the second test phaseand to select an optimal test phase; and

In at least one example, the operational phase selector selects theoperational phase of the clock signal based at least in part on theerror rate of the first test phase by selecting the operational phase ofthe clock signal based at least in part on the optimal test phase.

In at least one example, the interconnect apparatus further comprises areference voltage shifter, and an operational voltage selector, wherein:the reference voltage shifter is to shift a reference voltage by a testvoltage; wherein the error rate detector is further to measure an errorrate of the test voltage; and wherein the operational voltage selectoris to select an operational reference voltage of the clock signal basedat least in part on the error rate of the test voltage.

In at least one example, the test voltage is a first test voltage; thereference voltage shifter is further to shift the reference voltage by asecond test voltage; the error comparator is further to compare theerror rate of the first test voltage to an error rate of the second testvoltage and to select an optimal test voltage; and wherein theoperational voltage selector selects the operational voltage of theclock signal based at least in part on the first test voltage byselecting the operational voltage of the clock signal based at least inpart on the optimal test voltage.

In at least one example, the interconnect apparatus further comprises aneye constructor, and a two-dimensional factor shifter; wherein: the eyeconstructor is to construct an eye based at least in part on the optimalphase and the optimal voltage; the two dimensional factor shifter is toselect first and second phase and voltage pairs within the eye; theerror rate detector is further to measure an error rate for each of thefirst and second phase and voltage pairs; and the error rate detector isfurther to compare the error rate of the first phase and voltage pair tothe error rate of the second phase and voltage pair, and select anoptimal phase and voltage pair.

In at least one example, the error rate detector measures the error rateby receiving a test pattern onto a first lane, and a crosstalk patternon at least one adjacent lane.

In at least one example, the crosstalk pattern is a logical inverse ofthe test pattern.

In at least one example, the first virtual channel is a real-timevirtual channel (VC_RT) and the second virtual channel is an auxiliaryvirtual channel (VC_AUX).

While the present invention has been described with respect to a limitednumber of embodiments, those skilled in the art will appreciate numerousmodifications and variations therefrom. It is intended that the appendedclaims cover all such modifications and variations as fall within thetrue spirit and scope of this present invention.

A design may go through various stages, from creation to simulation tofabrication. Data representing a design may represent the design in anumber of manners. First, as is useful in simulations, the hardware maybe represented using a hardware description language or anotherfunctional description language. Additionally, a circuit level modelwith logic and/or transistor gates may be produced at some stages of thedesign process. Furthermore, most designs, at some stage, reach a levelof data representing the physical placement of various devices in thehardware model. In the case where conventional semiconductor fabricationtechniques are used, the data representing the hardware model may be thedata specifying the presence or absence of various features on differentmask layers for masks used to produce the integrated circuit. In anyrepresentation of the design, the data may be stored in any form of amachine readable medium. A memory or a magnetic or optical storage suchas a disc may be the machine readable medium to store informationtransmitted via optical or electrical wave modulated or otherwisegenerated to transmit such information. When an electrical carrier waveindicating or carrying the code or design is transmitted, to the extentthat copying, buffering, or re-transmission of the electrical signal isperformed, a new copy is made. Thus, a communication provider or anetwork provider may store on a tangible, machine-readable medium, atleast temporarily, an article, such as information encoded into acarrier wave, embodying techniques of embodiments of the presentinvention.

A module as used herein refers to any combination of hardware, software,and/or firmware. As an example, a module includes hardware, such as amicro-controller, associated with a non-transitory medium to store codeadapted to be executed by the micro-controller. Therefore, reference toa module, in one embodiment, refers to the hardware, which isspecifically configured to recognize and/or execute the code to be heldon a non-transitory medium. Furthermore, in another embodiment, use of amodule refers to the non-transitory medium including the code, which isspecifically adapted to be executed by the microcontroller to performpredetermined operations. And as can be inferred, in yet anotherembodiment, the term module (in this example) may refer to thecombination of the microcontroller and the non-transitory medium. Oftenmodule boundaries that are illustrated as separate commonly vary andpotentially overlap. For example, a first and a second module may sharehardware, software, firmware, or a combination thereof, whilepotentially retaining some independent hardware, software, or firmware.In one embodiment, use of the term logic includes hardware, such astransistors, registers, or other hardware, such as programmable logicdevices.

Use of the phrase ‘to’ or ‘configured to,’ in one embodiment, refers toarranging, putting together, manufacturing, offering to sell, importingand/or designing an apparatus, hardware, logic, or element to perform adesignated or determined task. In this example, an apparatus or elementthereof that is not operating is still ‘configured to’ perform adesignated task if it is designed, coupled, and/or interconnected toperform said designated task. As a purely illustrative example, a logicgate may provide a 0 or a 1 during operation. But a logic gate‘configured to’ provide an enable signal to a clock does not includeevery potential logic gate that may provide a 1 or 0. Instead, the logicgate is one coupled in some manner that during operation the 1 or 0output is to enable the clock. Note once again that use of the term‘configured to’ does not require operation, but instead focus on thelatent state of an apparatus, hardware, and/or element, where in thelatent state the apparatus, hardware, and/or element is designed toperform a particular task when the apparatus, hardware, and/or elementis operating.

Furthermore, use of the phrases ‘capable of/to,’ and or ‘operable to,’in one embodiment, refers to some apparatus, logic, hardware, and/orelement designed in such a way to enable use of the apparatus, logic,hardware, and/or element in a specified manner. Note as above that useof to, capable to, or operable to, in one embodiment, refers to thelatent state of an apparatus, logic, hardware, and/or element, where theapparatus, logic, hardware, and/or element is not operating but isdesigned in such a manner to enable use of an apparatus in a specifiedmanner.

A value, as used herein, includes any known representation of a number,a state, a logical state, or a binary logical state. Often, the use oflogic levels, logic values, or logical values is also referred to as 1'sand 0's, which simply represents binary logic states. For example, a 1refers to a high logic level and 0 refers to a low logic level. In oneembodiment, a storage cell, such as a transistor or flash cell, may becapable of holding a single logical value or multiple logical values.However, other representations of values in computer systems have beenused. For example the decimal number ten may also be represented as abinary value of 1010 and a hexadecimal letter A. Therefore, a valueincludes any representation of information capable of being held in acomputer system.

Moreover, states may be represented by values or portions of values. Asan example, a first value, such as a logical one, may represent adefault or initial state, while a second value, such as a logical zero,may represent a non-default state. In addition, the terms reset and set,in one embodiment, refer to a default and an updated value or state,respectively. For example, a default value potentially includes a highlogical value, i.e. reset, while an updated value potentially includes alow logical value, i.e. set. Note that any combination of values may beutilized to represent any number of states.

The embodiments of methods, hardware, software, firmware or code setforth above may be implemented via instructions or code stored on amachine-accessible, machine readable, computer accessible, or computerreadable medium which are executable by a processing element. Anon-transitory machine-accessible/readable medium includes any mechanismthat provides (i.e., stores and/or transmits) information in a formreadable by a machine, such as a computer or electronic system. Forexample, a non-transitory machine-accessible medium includesrandom-access memory (RAM), such as static RAM (SRAM) or dynamic RAM(DRAM); ROM; magnetic or optical storage medium; flash memory devices;electrical storage devices; optical storage devices; acoustical storagedevices; other form of storage devices for holding information receivedfrom transitory (propagated) signals (e.g., carrier waves, infraredsignals, digital signals); etc, which are to be distinguished from thenon-transitory mediums that may receive information there from.

Instructions used to program logic to perform embodiments of theinvention may be stored within a memory in the system, such as DRAM,cache, flash memory, or other storage. Furthermore, the instructions canbe distributed via a network or by way of other computer readable media.Thus a machine-readable medium may include any mechanism for storing ortransmitting information in a form readable by a machine (e.g., acomputer), but is not limited to, floppy diskettes, optical disks,Compact Disc, Read-Only Memory (CD-ROMs), and magneto-optical disks,Read-Only Memory (ROMs), Random Access Memory (RAM), ErasableProgrammable Read-Only Memory (EPROM), Electrically ErasableProgrammable Read-Only Memory (EEPROM), magnetic or optical cards, flashmemory, or a tangible, machine-readable storage used in the transmissionof information over the Internet via electrical, optical, acoustical orother forms of propagated signals (e.g., carrier waves, infraredsignals, digital signals, etc.). Accordingly, the computer-readablemedium includes any type of tangible machine-readable medium suitablefor storing or transmitting electronic instructions or information in aform readable by a machine (e.g., a computer)

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the present invention. Thus, theappearances of the phrases “in one embodiment” or “in an embodiment” invarious places throughout this specification are not necessarily allreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments.

In the foregoing specification, a detailed description has been givenwith reference to specific exemplary embodiments. It will, however, beevident that various modifications and changes may be made theretowithout departing from the broader spirit and scope of the invention asset forth in the appended claims. The specification and drawings are,accordingly, to be regarded in an illustrative sense rather than arestrictive sense. Furthermore, the foregoing use of embodiment andother exemplarily language does not necessarily refer to the sameembodiment or the same example, but may refer to different and distinctembodiments, as well as potentially the same embodiment.

What is claimed is:
 1. An interconnect apparatus, comprising: a clocksignal generator to generator a clock signal; a reference voltageshifter to shift a reference voltage of the clock signal by a testvoltage at an operational speed of the interconnect; an error ratedetector to measure an error rate of the test voltage; and anoperational voltage selector to select an operational reference voltageof the clock signal based at least in part on the error rate of the testvoltage.
 2. The interconnect apparatus of claim 1, further comprising anerror comparator, wherein: the test voltage is a first test voltage; thereference voltage shifter is further to shift the reference voltage by asecond test voltage; the error comparator is to compare the error rateof the first test voltage to an error rate of the second test voltageand to select an optimal test voltage; and wherein the operationalvoltage selector is to select the operational voltage of the clocksignal based at least in part on the first test voltage by selecting theoperational voltage of the clock signal based at least in part on theoptimal test voltage.
 3. The interconnect apparatus of claim 2, furthercomprising a phase shifter and an operational phase selector, wherein:the clock generator is to generate the clock signal at a low speed forthe interconnect; the phase shifter is to phase shift the clock signalby a test phase; the error rate detector is to measure an error rate ofthe test phase; and the operational phase selector is to select anoperational phase of the clock signal based at least in part on theerror rate of the test phase.
 4. The interconnect apparatus of claim 3,wherein the phase shifter is a quantized phase shifter.
 5. Theinterconnect apparatus of claim 3, further comprising an errorcomparator, wherein the test phase is a first test phase, and wherein:the phase shifter is further to shift the clock signal by a second testphase; the error rate detector is further to measure an error of thesecond test phase; the error comparator is to compare the error rate ofthe first test phase to the error rate of the second test phase and toselect an optimal test phase; and the operational phase selector is toselect the operational phase of the clock signal based at least in parton the error rate of the first test phase by selecting the operationalphase of the clock signal based at least in part on the optimal testphase.
 6. The interconnect apparatus of claim 5, further comprising aneye constructor, and a two-dimensional factor shifter; wherein: the eyeconstructor is to construct an eye based at least in part on the optimaltest phase and the optimal test voltage; the two dimensional factorshifter is to select first and second phase and voltage pairs within theeye; the error rate detector is further to measure an error rate foreach of the first and second phase and voltage pairs; and the error ratedetector is further to compare the error rate of the first phase andvoltage pair to the error rate of the second phase and voltage pair, andselect an optimal phase and voltage pair.
 7. The interconnect apparatusof claim 3, wherein the error rate detector measures the error rate byreceiving a test pattern onto a first lane, and a crosstalk pattern onat least one adjacent lane.
 8. The interconnect apparatus of claim 7,wherein the crosstalk pattern is a logical inverse of the test pattern.9. A system, comprising: a first agent; a second agent; and aninterconnect to communicatively couple the first agent to the secondagent, comprising: a clock signal generator to generator a clock signal;a reference voltage shifter to shift a reference voltage of the clocksignal by a test voltage at an operational speed of the interconnect; anerror rate detector to measure an error rate of the test voltage; and anoperational voltage selector to select an operational reference voltageof the clock signal based at least in part on the error rate of the testvoltage.
 10. The system of claim 9, wherein the interconnect furthercomprises an error comparator, wherein: the test voltage is a first testvoltage; the reference voltage shifter is further to shift the referencevoltage by a second test voltage; the error comparator is to compare theerror rate of the first test voltage to an error rate of the second testvoltage and to select an optimal test voltage; and wherein theoperational voltage selector is to select the operational voltage of theclock signal based at least in part on the first test voltage byselecting the operational voltage of the clock signal based at least inpart on the optimal test voltage.
 11. The system of claim 10, whereinthe interconnect further comprises an error comparator, wherein: theclock generator is to generate the clock signal at a low speed for theinterconnect; the phase shifter is to phase shift the clock signal by atest phase; the error rate detector is to measure an error rate of thetest phase; and the operational phase selector is to select anoperational phase of the clock signal based at least in part on theerror rate of the test phase.
 12. The system of claim 11, wherein thephase shifter is a quantized phase shifter.
 13. The system of claim 11,wherein the interconnect further comprises an error comparator, whereinthe test phase is a first test phase, and wherein: the phase shifter isfurther to shift the clock signal by a second test phase; the error ratedetector is further to measure an error of the second test phase; theerror comparator is to compare the error rate of the first test phase tothe error rate of the second test phase and to select an optimal testphase; and the operational phase selector is to select the operationalphase of the clock signal based at least in part on the error rate ofthe first test phase by selecting the operational phase of the clocksignal based at least in part on the optimal test phase.
 14. The systemof claim 13, further comprising an eye constructor, and atwo-dimensional factor shifter; wherein: the eye constructor is toconstruct an eye based at least in part on the optimal test phase andthe optimal test voltage; the two dimensional factor shifter is toselect first and second phase and voltage pairs within the eye; theerror rate detector is further to measure an error rate for each of thefirst and second phase and voltage pairs; and the error rate detector isfurther to compare the error rate of the first phase and voltage pair tothe error rate of the second phase and voltage pair, and select anoptimal phase and voltage pair.
 15. The system of claim 11, wherein theerror rate detector measures the error rate by receiving a test patternonto a first lane, and a crosstalk pattern on at least one adjacentlane.
 16. The system of claim 15, wherein the crosstalk pattern is alogical inverse of the test pattern.
 17. One or more tangible,non-transitory computer-readable storage mediums having stored thereonexecutable instructions to: generate a clock signal; shift a referencevoltage of the clock signal by a test voltage at an operational speed ofthe interconnect; measure an error rate of the test voltage; and selectan operational reference voltage of the clock signal based at least inpart on the error rate of the test voltage.
 18. The one or moretangible, non-transitory computer-readable mediums of claim 17, whereinthe test voltage is a first test voltage, and wherein the instructionsare further to; shift the reference voltage by a second test voltage;compare the error rate of the first test voltage to an error rate of thesecond test voltage and to select an optimal test voltage; and selectthe operational voltage of the clock signal based at least in part onthe first test voltage by selecting the operational voltage of the clocksignal based at least in part on the optimal test voltage.
 19. The oneor more tangible, non-transitory computer-readable mediums of claim 18,wherein the instructions are further to: generate the clock signal at alow speed for the interconnect; shift the clock signal by a test phase;measure an error rate of the test phase; and select an operational phaseof the clock signal based at least in part on the error rate of the testphase.
 20. The one or more tangible, non-transitory computer-readablemediums of claim 19, wherein the phase shifter is a quantized phaseshifter.
 21. The one or more tangible, non-transitory computer-readablemediums of claim 19, wherein the test phase is a first test phase, andthe instructions are further to: shift the clock signal by a second testphase; measure an error of the second test phase; compare the error rateof the first test phase to the error rate of the second test phase andto select an optimal test phase; and select the operational phase of theclock signal based at least in part on the error rate of the first testphase by selecting the operational phase of the clock signal based atleast in part on the optimal test phase.
 22. The one or more tangible,non-transitory computer-readable mediums of claim 21, wherein theinstructions are further to: construct an eye based at least in part onthe optimal test phase and the optimal test voltage; select first andsecond phase and voltage pairs within the eye; measure an error rate foreach of the first and second phase and voltage pairs; and compare theerror rate of the first phase and voltage pair to the error rate of thesecond phase and voltage pair, and select an optimal phase and voltagepair.
 23. The one or more tangible, non-transitory computer-readablemediums of claim 19, wherein measuring the error rate comprisesreceiving a test pattern onto a first lane, and a crosstalk pattern onat least one adjacent lane.
 24. The one or more tangible, non-transitorycomputer-readable mediums of claim 24, wherein the crosstalk pattern isa logical inverse of the test pattern.